03833nam 22006254a 450 991100480060332120200520144314.01-282-01328-997866120132870-8155-1600-2(CKB)1000000000210787(EBL)428576(OCoLC)437112411(SSID)ssj0000071369(PQKBManifestationID)11109727(PQKBTitleCode)TC0000071369(PQKBWorkID)10091542(PQKB)10757260(MiAaPQ)EBC428576(MiAaPQ)EBC4668822(EXLCZ)99100000000021078720050502d2005 uy 0engur|n|---|||||txtccrAdhesives technology for electronic applications materials, processes, reliability /by James J. Licari and Dale W. SwansonNorwich, NY William Andrew Pub.c20051 online resource (477 p.)Materials and processes for electronic applications seriesDescription based upon print version of record.0-8155-1513-8 Includes bibliographical references and index.Front Cover; Adhesives Technology for Electronic Applications: Materials, Processes, Reliability; Copyright Page; Table of Contents; Chapter 1. Introduction; 1.1 ADHESIVE TYPES AND DEFINITIONS; 1.2 SUMMARY OF PACKAGING TECHNOLOGIES; 1.3 HISTORY OF ADHESIVES IN ELECTRONIC APPLICATIONS; 1.4 COMPARISON OF POLYMER ADHESIVES WITH METALLURGICAL AND VITREOUS ATTACHMENT MATERIALS; 1.5 SPECIFICATIONS; 1.6 THE MARKET; REFERENCES; Chapter 2. Functions and Theory of Adhesives; 2.1 MECHANICAL ATTACHMENT; 2.2 ELECTRICAL CONNECTIONS; 2.3 THERMAL DISSIPATION; 2.4 STRESS DISSIPATION; REFERENCESChapter 3. Chemistry, Formulation, and Properties of Adhesives3.1 CHEMISTRY; 3.2 FORMULATION; 3.3 PROPERTIES; REFERENCES; Chapter 4. Adhesive Bonding Processes; 4.1 CLEANING; 4.2 SURFACE TREATMENTS; 4.3 ADHESIVE DISPENSING; 4.4 PLACEMENT OF DEVICES AND COMPONENTS; 4.5 CURING; 4.6 REWORK; REFERENCES; Chapter 5. Applications; 5.1 GENERAL APPLICATIONS; 5.2 SPECIFIC APPLICATIONS; REFERENCES; Chapter 6. Reliability; 6.1 FAILURE MODES AND MECHANISMS; 6.2 SPECIFICATIONS; REFERENCES; Chapter 7. Test and Inspection Methods; 7.1 PHYSICAL TESTS; 7.2 ELECTRICAL TESTS; 7.3 ENVIRONMENTAL TESTS7.4 THERMAL TESTS7.5 MECHANICAL AND THERMOMECHANICAL TESTS; 7.6 CHEMICAL ANALYSIS; REFERENCES; Appendix; CONVERSION FACTORS; ABBREVIATIONS, ACRONYMS, AND SYMBOLS; IndexThis book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and relMaterials and processes for electronic applications series.ElectronicsMaterialsAdhesivesElectronic packagingElectronicsMaterials.Adhesives.Electronic packaging.621.381Licari James J.1930-1404327Swanson Dale W1822367MiAaPQMiAaPQMiAaPQBOOK9911004800603321Adhesives technology for electronic applications4391990UNINA