04088nam 2200649 a 450 991100476450332120200520144314.01-283-15268-197866131526881-4377-7890-9(CKB)2670000000092965(EBL)727062(OCoLC)735603879(SSID)ssj0000507823(PQKBManifestationID)12204191(PQKBTitleCode)TC0000507823(PQKBWorkID)10547606(PQKB)10867948(MiAaPQ)EBC727062(PPN)153878134(EXLCZ)99267000000009296520110713d2011 uy 0engur|n|---|||||txtccrAdhesives technology for electronic applications materials, processing, reliability /James J. Licari and Dale W. Swanson2nd ed.Boston Elsevierc20111 online resource (415 p.)Materials and processes for electronic applications seriesDescription based upon print version of record.0-12-810370-1 1-4377-7889-5 Includes bibliographical references and index.Front Cover; Dedication; Adhesives Technology for Electronic Applications: Materials, Processing, Reliability; Copyright; Contents; Preface; Acknowledgments; Disclaimer; Chapter 1 -Introduction; 1.1 -Adhesive types and classifications; 1.2 -Summary of packaging technologies; 1.3 -History of adhesives in electronic applications; 1.4 -Comparison of polymer adhesives with metallurgical and vitreous attachment materials; 1.5 -Specifications; 1.6 -Market and market trends; References; Chapter 2 -Functions and theory of adhesives; 2.1 -Mechanical attachment; 2.2 -Electrical connections2.3 -Thermal dissipation2.4 -Stress dissipation; References; Chapter 3 -Chemistry, Formulation, and Properties of Adhesives; 3.1 -Chemistry; 3.2 -Formulation additives; 3.3 -Formulation processes; 3.4 -Properties; References; Chapter 4 -Adhesive Bonding Processes; 4.1 -Cleaning; 4.2 -Surface treatments; 4.3 -Adhesive dispensing; 4.4 -Placement of devices and components; 4.5 -Curing; 4.6 -Rework; References; Chapter 5 -Applications; 5.1 -General applications; 5.2 -Specific applications; References; Chapter 6 -Reliability; 6.1 -Physics of failure methodology; 6.2 -Failure modes and mechanisms6.3 -Reliability prediction and modeling6.4 -Qualification, quality control, and specifications; References; Chapter 7 -Test and Inspection Methods; 7.1 -Physical tests; 7.2 -Electrical tests; 7.3 -Environmental tests; 7.4 -Thermal tests; 7.5 -Mechanical and thermomechanical tests; 7.6 -Chemical analysis; References; Appendix; Conversion factors; Abbreviations, Acronyms, and Symbols; Index Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this bMaterials and processes for electronic applications series.ElectronicsMaterialsAdhesivesElectronic packagingElectronicsMaterials.Adhesives.Electronic packaging.621.381Licari James J1822366Swanson Dale W1822367MiAaPQMiAaPQMiAaPQBOOK9911004764503321Adhesives technology for electronic applications4388527UNINA