01081nac# 22002291i 450 UON0003857420231205102135.56220020107f |0itac50 baIT|||| |||||b||||||||||ˆLe ‰Querce001UON000382892001 ˆIl ‰Corano[introduzione, traduzione e commento di A. Bausani]205 Seconda edizione210 FirenzeSansoni1989215 LXXIX, 771 p.22 cm001UON001570022001 Guerra santa contro McMondoBenjamin R. Barber205 2a ed210 MilanoTropea2002215 xxxiv, 319 p.22 cm001UON001553222001 ˆL'‰ulivo e le pietreUgo Tramballi210 MilanoTropeac2002215 xiii, 240 p.22 cm001UON001553212001 ˆLa ‰verità negataJean-Charles Brisard, Guillaume Dasquié210 MilanoTropeac2002215 219 p.22 cmITMilanoUONL000005TropeaUONV264935650ITSOL20240220RICAUON00038574Querce64194UNIOR03614nam 22005894a 450 991096345530332120251116210451.01-61503-093-X(CKB)2560000000049842(EBL)3002391(OCoLC)729262390(SSID)ssj0000485519(PQKBManifestationID)11307144(PQKBTitleCode)TC0000485519(PQKBWorkID)10603902(PQKB)10073509(MiAaPQ)EBC3002391(Au-PeEL)EBL3002391(CaPaEBR)ebr10320384(BIP)12443472(EXLCZ)99256000000004984220050525d2005 uy 0engurcn|||||||||txtccrLead-free solder interconnect reliability /edited by Dongkai Shangguan1st ed.Materials Park, OH ASM International20051 online resource (302 p.)Description based upon print version of record.0-87170-816-7 Includes bibliographical references and index.""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects""""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index""This book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed. Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging. Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. This book is the first comprehensive guide to reliability of lead-free solder interconnects.Microelectronic packagingReliabilitySolder and solderingLead-free electronics manufacturing processesMicroelectronic packagingReliability.Solder and soldering.Lead-free electronics manufacturing processes.621.381/046Shangguan Dongkai1963-1868863MiAaPQMiAaPQMiAaPQBOOK9910963455303321Lead-free solder interconnect reliability4476908UNINA