01871oam 2200481zu 450 991087298960332120210807003534.0(CKB)111055184249194(SSID)ssj0000558263(PQKBManifestationID)12250512(PQKBTitleCode)TC0000558263(PQKBWorkID)10558970(PQKB)11726296(NjHacI)99111055184249194(EXLCZ)9911105518424919420160829d2000 uy engur|||||||||||txtccr2000 3rd Electronics Packaging Technology Conference[Place of publication not identified]I E E E20001 online resourceBibliographic Level Mode of Issuance: Monograph0-7803-6644-1 Includes bibliographical references and index.Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.Electronic packagingCongressesElectronic packaging621.381/046Lim Thiam Beng1230133Lee Charles387058Toh Kok Chuan1230134IEEE Reliability/CPMT/ED Singapore Chapter.Components, Packaging & Manufacturing Technology Society.International Microelectronics and Packaging Society.Electronics Packaging Technology Conference(3rd :2000 :Singapore)PQKBPROCEEDING99108729896033212000 3rd Electronics Packaging Technology Conference2855463UNINA