01938nas 22005173a 450 991087266100332120180126060716.62162-0334(OCoLC)430058414(CKB)1000000000771036(CONSER)--2009204101(EXLCZ)99100000000077103620090811a20079999 s-- aengur|||||||||||txtrdacontentcrdamediacrrdacarrierProceedings of technical papersPiscataway, NJ Institute of Electrical and Electronics EngineersPublished by Institute of Electrical and Electronics Engineers in association with individual conference organizations.2150-5934 Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), InternationalInternational Microsystems, Packaging, Assembly, and Circuits Technology ConferenceIMPACTINTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGYProc. tech. pap.Microelectronic packagingCongressesElectronic packagingCongressesMicroelectronicsCongressesElectronic packagingfast(OCoLC)fst00907414Microelectronic packagingfast(OCoLC)fst01019751Microelectronicsfast(OCoLC)fst01019757Conference papers and proceedings.fastMicroelectronic packagingElectronic packagingMicroelectronicsElectronic packaging.Microelectronic packaging.Microelectronics.621.381Institute of Electrical and Electronics Engineers.CONFERENCE9910872661003321Proceedings of technical papers1888335UNINA