01715oam 2200457zu 450 991087265880332120210807003350.0(CKB)111026746723938(SSID)ssj0000395387(PQKBManifestationID)12171110(PQKBTitleCode)TC0000395387(PQKBWorkID)10450866(PQKB)11578869(EXLCZ)9911102674672393820160829d1998 uy engtxtccrIWIPP proceedings : IEEE International Workshop on Integrated Power Packaging : the Congress Plaza Hotel, Chicago, Illinois, USA, September 17-19, 1998[Place of publication not identified]IEEE1998Bibliographic Level Mode of Issuance: Monograph0-7803-5033-2 Electronic packagingCongressesPower electronicsCongressesElectrical & Computer EngineeringHILCCEngineering & Applied SciencesHILCCElectrical EngineeringHILCCElectronic packagingPower electronicsElectrical & Computer EngineeringEngineering & Applied SciencesElectrical Engineering621.381/045Components, Packaging & Manufacturing Technology SocietyIEEE International Workshop on Integrated Power PackagingPQKBPROCEEDING9910872658803321IWIPP proceedings : IEEE International Workshop on Integrated Power Packaging : the Congress Plaza Hotel, Chicago, Illinois, USA, September 17-19, 19982525514UNINA