02353oam 2200421zu 450 991087262760332120241212214919.0(CKB)111026746729636(SSID)ssj0000557907(PQKBManifestationID)12228078(PQKBTitleCode)TC0000557907(PQKBWorkID)10559424(PQKB)10111546(NjHacI)99111026746729636(EXLCZ)9911102674672963620160829d2000 uy engur|||||||||||txtccrAdhesive Joining and Coating Technology in Electronics Manufacturing, 2000: 4th International Conference[Place of publication not identified]I E E E20001 online resourceBibliographic Level Mode of Issuance: Monograph9780780364608 0780364600 New isotropic conductive adhesive (ICA) for plated Sn or Sn/Pb electrode was developed. The new ICA and our existing ICA were evaluated for SMT as lead containing solder replacement, using on-chip resistors with plated Sn/Pb (90/10) and fired Ag/Pd terminations, from contact resistance and adhesion strength points of view. The new ICA gave more stable contact resistance and adhesion strength through reliability testing, even in the case of using 0/spl Omega/ chip resistor with plated Sn/Pb termination. Formation of boundaries or Sn grains on the surface and diffusion of Ni into Sn/Pb layer in the cross section, after chip resistors with plated Sn/Pb termination exposed to several reliability conditions, were observed by SEM and EDX. Though degree of these changes of plated Sn/Pb termination depends on each exposure condition, it can be estimated that the new ICA gets less influence by the changes of plated Sn/Pb termination and that it has some effect which prevents changing by plated Sn/Pb termination before it occurs.Protective coatingsProtective coatings.621.381/046Hyytiäinen Marika1229392Nokia (Firm)PQKBPROCEEDING9910872627603321Adhesive Joining and Coating Technology in Electronics Manufacturing, 2000: 4th International Conference2853620UNINA