01859oam 2200529zu 450 991087242160332120241212215302.0(CKB)1000000000022004(SSID)ssj0000394322(PQKBManifestationID)12122690(PQKBTitleCode)TC0000394322(PQKBWorkID)10386940(PQKB)11064996(EXLCZ)99100000000002200420160829d2003 uy engtxtccrDesign, test, integration and packaging of MEMS/MOEMS 2003 : DTIP 2003 : 5-7 May, 2003, Cannes, France[Place of publication not identified]IEEE2003Bibliographic Level Mode of Issuance: Monograph9780780370661 078037066X Microelectromechanical systemsCongressesOptoelectronic devicesCongressesMicromachiningCongressesMicroelectronic packagingCongressesElectrical & Computer EngineeringHILCCElectrical EngineeringHILCCEngineering & Applied SciencesHILCCMicroelectromechanical systemsOptoelectronic devicesMicromachiningMicroelectronic packagingElectrical & Computer EngineeringElectrical EngineeringEngineering & Applied Sciences621.381Bergman KerenCentre national de la recherche scientifique (France)Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS(5th :2003 :Cannes, France)PQKBPROCEEDING9910872421603321Design, Test, Integration and Packaging of MEMS1889065UNINA