01747oam 2200493zu 450 991087242010332120241212215304.0(CKB)1000000000022191(SSID)ssj0000394644(PQKBManifestationID)12107825(PQKBTitleCode)TC0000394644(PQKBWorkID)10387427(PQKB)11051778(EXLCZ)99100000000002219120160829d2003 uy engtxtccrICEPT2003 : Fifth International Conference on Electronic Packaging Technology : proceedings : Oct. 28-30, 2003, Shanghai, China[Place of publication not identified]IEEE2003Bibliographic Level Mode of Issuance: Monograph9780780381681 0780381688 Electronic packagingCongressesElectrical & Computer EngineeringHILCCElectrical EngineeringHILCCEngineering & Applied SciencesHILCCElectronic packagingElectrical & Computer EngineeringElectrical EngineeringEngineering & Applied Sciences621.381/046Barnwell Peter GBi KeyunWang JZhongguo dian zi xue huiComponents, Packaging & Manufacturing Technology SocietyInternational Conference on Electronic Packaging TechnologyPQKBPROCEEDING9910872420103321ICEPT2003 : Fifth International Conference on Electronic Packaging Technology : proceedings : Oct. 28-30, 2003, Shanghai, China2510473UNINA