04436nam 2200541 450 991083107590332120170919155157.03-527-69100-63-527-69099-9(CKB)3710000000637151(EBL)4504069(MiAaPQ)EBC4504069(PPN)197735614(EXLCZ)99371000000063715120160426h20162016 uy 0engur|n|---|||||rdacontentrdamediardacarrierSilicon nanomembranes fundamental science and applications /edited by John A. Rogers and Jong-Hyun AhnWeinheim, Germany :Wiley-VCH Verlag GmbH & Co. KGaA,2016.©20161 online resource (369 p.)Description based upon print version of record.3-527-69101-4 3-527-33831-4 Includes bibliographical references at the end of each chapters and index.Cover; Title Page; Copyright; Contents; List of Contributors; Part 1 Materials and Processes; Chapter 1 Synthesis, Assembly, and Applications of Semiconductor Nanomembranes; 1.1 Introduction; 1.2 Strategies for Forming Silicon Nanomembranes; 1.2.1 Selective Etching to Release Nanomembranes from Layered Assemblies; 1.2.2 Anisotropic Etching to Release Silicon Nanomembranes from Bulk Silicon Wafers; 1.3 Transfer Printing for Deterministic Assembly; 1.3.1 Introduction; 1.3.2 Mechanics of Transfer Printing; 1.3.3 Transfer Printing for Single- and Multilayer Deterministic Assembly1.4 Compressive Buckling for Deterministic Assembly1.4.1 Introduction; 1.4.2 Buckling on Compliant Substrates for Wavy Layouts; 1.4.3 Patterned Adhesion for Controlled, Large-Scale Buckling; 1.4.4 Deterministic Assembly of Complex, Three-Dimensional Architectures by Compressive Buckling; 1.5 Functional Devices Made from Silicon Nanomembranes; 1.5.1 Physically Transient Electronics; 1.5.2 Injectable, Cellular-Scale Optoelectronic Devices for the Brain; 1.5.3 Three-Dimensional Integumentary Membranes for Spatiotemporal Cardiac Measurements; 1.5.4 Arthropod Eyes Inspired Digital Camera1.5.5 Cephalopod Skins Inspired Optoelectronic Camouflage Systems1.6 Conclusions and Outlook; References; Chapter 2 Models of Reactive Diffusion for Resorbable Electronics; 2.1 Introduction; 2.2 Hydrolysis of Silicon Nanomembranes; 2.3 Material-Level Dissolution; 2.4 Dissolution of Device with Layered Structures; 2.5 Discussion and Conclusion; Acknowledgments; References; Part 2 Applications in Bio-Integrated and Flexible Electronics; Chapter 3 Transparent and Foldable Electronics Enabled by Si Nanomembranes; 3.1 Introduction; 3.2 Fabrication; 3.3 Characterization3.3.1 Mechanical Properties of Si NM in Bending and Stretching3.3.2 Optical Properties; 3.3.3 Piezoresistive Effect in Si NM; 3.4 Configurations of Transparent and Foldable Electronic Devices; 3.4.1 Representative Materials for Transparent and Foldable Electronics; 3.4.2 Electrical and Optical Properties of Transparent TFTs; 3.4.3 Modification of the Bending Stiffness with Substrate Thickness; 3.4.4 Electromechanical Properties of Foldable TFTs; 3.4.5 Control of Stiffness by Thinning of Si for Stretchable Electronic Devices; 3.4.6 Control of Strain Distribution by Geometrical Design3.4.7 Mechanical Properties of Stretchable Inverters3.5 Concluding Remarks; References; Chapter 4 High-Performance Flexible Electronic and Optoelectronic Devices by Mechanical Exfoliation from a Brittle Substrate; 4.1 Introduction; 4.2 Steady-State Substrate Cracking Parallel to the Interface in a Bilayers; 4.3 Spalling-Mode Fracture for Layer Transfer; 4.4 High-Performance Flexible Electronics by Controlled Spalling; 4.4.1 Ultra-Low-Power Nanoscale Silicon Integrated Circuits on Plastic; 4.4.2 Electrical Characteristics of Flexible Devices and Circuits4.4.3 Effect of Strain on Device PerformanceMembranes (Technology)NanosiliconMembranes (Technology)Nanosilicon.660.2842Rogers John A.Ahn Jong-HyunMiAaPQMiAaPQMiAaPQBOOK9910831075903321Silicon nanomembranes3931111UNINA