02548oam 2200529 450 991044724110332120210612153030.03-030-67238-710.1007/978-3-030-67238-6(CKB)4100000011704520(DE-He213)978-3-030-67238-6(MiAaPQ)EBC6452022(PPN)253253764(EXLCZ)99410000001170452020210612d2020 uy 0engurnn#008mamaatxtrdacontentcrdamediacrrdacarrierElectronic governance and open society, challenges in Eurasia 7th International Conference, EGOSE 2020, St. Petersburg, Russia, November 18-19, 2020 : proceedings /Edited by Andrei Chugunov [and three others]1st ed. 2020.Cham, Switzerland :Springer,[2020]©20201 online resource (xvi, 336 p. ) illCommunications in Computer and Information Science,1865-0929 ;1349Includes index.3-030-67237-9 Digital government: services, policies, laws, practices, surveillance -- Digital society: openness, participation, trust, competences -- Digital data: data science, methods, modelling, AI, NLP.This book constitutes the refereed proceedings of the 7th Conference on Electronic Governance and Open Society: Challenges in Eurasia, EGOSE 2020, held in St. Petersburg, Russia, in November 2020. The 35 full papers and 5 short papers were carefully reviewed and selected from 59 submissions. The papers are organized in topical sections on digital government: services, policies, laws, practices, surveillance; digital society: openness, participation, trust, competences; digital data: data science, methods, modelling, AI, NLP.Communications in Computer and Information Science,1865-0929 ;1349Artificial intelligenceApplication softwareInternet in public administrationCongressesArtificial intelligence.Application software.Internet in public administration351.0285467832.24.28EP-CLASSChugunov A(Andreĭ),1827-1898,MiAaPQMiAaPQUtOrBLWBOOK9910447241103321Electronic Governance and Open Society: Challenges in Eurasia1959954UNINA05143nam 2200649Ia 450 991083016950332120230721005802.01-282-16549-697866121654980-470-61180-40-470-61027-1(CKB)2550000000005852(EBL)477640(OCoLC)521033639(SSID)ssj0000354525(PQKBManifestationID)11267480(PQKBTitleCode)TC0000354525(PQKBWorkID)10302468(PQKB)11707140(MiAaPQ)EBC477640(EXLCZ)99255000000000585220080822d2009 uy 0engur|n|---|||||txtccrNano and micromachining[electronic resource] /edited by J. Paulo Davim, Mark J. JacksonHoboken, NJ John Wiley & Sons20091 online resource (224 p.)ISTEDescription based upon print version of record.1-84821-103-1 Includes bibliographical references and index.Nano and Micromachining; Table of Contents; Preface; Chapter 1. Nanoscale Cutting; 1.1. Introduction; 1.2. Basic elements of molecular dynamics modeling; 1.2.1. Material representation and microstructure; 1.2.2. Atomic interaction; 1.2.3. System dynamics and numerical description; 1.2.4. Boundary conditions; 1.3. Design and requirements for state-of-the-art MD cutting process simulations; 1.4. Capabilities of MD for nanoscale material removal process analysis; 1.4.1. Analysis of microstructure and deformation; 1.4.2. Obtaining cutting forces, stress and temperature1.5. Advances and recent developments in material removal process simulation1.5.1. Complete 3D surface machining simulation; 1.5.2. Consideration of fluids in MD cutting simulation; 1.6. Summary and outlook; 1.7. References; Chapter 2. Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces; 2.1. Introduction; 2.2. The mechanism of ductile mode cutting of brittle materials; 2.2.1. Transition of chip formation mode from ductile to brittle; 2.2.2. MD modeling and simulation of nanoscale ductile mode cutting of silicon2.2.3. The mechanism of ductile mode chip formation in cutting of silicon2.3. The chip formation in cutting of brittle materials; 2.3.1. Material deformation and crack initiation in the chip formation zone; 2.3.2. Stress conditions in the chip formation zone in relation to ductile-brittle mode of chip formation; 2.4. Machined surfaces in relation to chip formation mode; 2.5. References; Chapter 3. Diamond Tools in Micromachining; 3.1. Introduction; 3.2. Diamond technology; 3.2.1. Hot Filament CVD (HFCVD); 3.3. Preparation of substrate; 3.3.1. Selection of substrate material3.3.2. Pre-treatment of substrate3.4. Modified HFCVD process; 3.4.1. Modification of filament assembly; 3.4.2. Process conditions; 3.5. Nucleation and diamond growth; 3.5.1. Nucleation; 3.5.2. Bias-enhanced nucleation (BEN); 3.5.3. Influence of temperature; 3.6. Deposition on complex substrates; 3.6.1. Diamond deposition on metallic (molybdenum) wire; 3.6.2. Deposition on WC-Co microtools; 3.6.3. Diamond deposition on tungsten carbide (WC-Co) microtool; 3.7. Diamond micromachining; 3.7.1. Performance of diamond-coated microtool; 3.8. Conclusions; 3.9. ReferencesChapter 4. Conventional Processes: Microturning, Microdrilling and Micromilling4.1. Introduction; 4.1.1. Definitions and technological possibilities; 4.1.2. Main applications of micromachining; 4.2. Microturning; 4.2.1. Characteristic features and applications; 4.2.2. Microturning tools and tooling systems; 4.2.3. Machine tools for microturning; 4.3. Microdrilling; 4.3.1. Characteristic features and applications; 4.3.2. Microdrills and tooling systems; 4.3.3. Machine tools for microdrilling; 4.4. Micromilling; 4.4.1. Characteristic features and applications4.4.2. Micromills and tooling systemsThis book provides the fundamentals and recent advances in nano and micromachining for modern manufacturing engineering. It begins by outlining nanomachining before discussing various advances in field and machining processes. The coverage concludes with an evaluation of subsurface damages in nano and micromachining and a presentation of applications in industry. As such, this book serves both as a useful classroom text for engineering and machining courses at the undergraduate and graduate level, and as a reference for academics and engineers in these areas.ISTENanotechnologyMicromachiningNanotechnology.Micromachining.620.5620/.5Davim J. Paulo739914Jackson Mark J322976MiAaPQMiAaPQMiAaPQBOOK9910830169503321Nano and micromachining4044407UNINA