02396nam 2200505 450 991083004670332120220920221729.01-119-41833-X1-119-41834-81-119-41832-110.1002/9781119418344(MiAaPQ)EBC6826401(Au-PeEL)EBL6826401(CKB)20133957500041(OCoLC)1289372266(OCoLC)1268544247(OCoLC-P)1268544247(CaSebORM)9781119418313(EXLCZ)992013395750004120220827d2022 fy 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierElectronic packaging science and technology /King-Ning Tu, Chih Chen, Hung-Ming ChenNewark :John Wiley & Sons,[2022]©20221 online resource (330 pages)Print version: Tu, King-Ning Electronic Packaging Science and Technology Newark : John Wiley & Sons, Incorporated,c2021 9781119418313 Electronic packaging."This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"--Provided by publisher.Electronic packagingElectronic packaging.621.381046Tu K. N(King-Ning),1937-1680458Chen Chih1970-Chen Hung-MingMiAaPQMiAaPQMiAaPQBOOK9910830046703321Electronic packaging science and technology4049175UNINA