03942nam 2200661Ia 450 991082641290332120230725052455.01-118-06314-71-283-37153-797866133715390-470-60262-70-470-60263-5(CKB)3400000000000257(EBL)661647(OCoLC)792932606(SSID)ssj0000477764(PQKBManifestationID)11320093(PQKBTitleCode)TC0000477764(PQKBWorkID)10514061(PQKB)10768687(MiAaPQ)EBC661647(Au-PeEL)EBL661647(CaPaEBR)ebr10510261(CaONFJC)MIL337153(EXLCZ)99340000000000025720100504d2010 uy 0engur|n|---|||||txtccrModern electroplating /edited by Mordechay Schlesinger, Milan Paunovic5th ed.Hoboken, NJ Wileyc20101 online resource (749 p.)The ECS series of texts and monographs ;52Description based upon print version of record.0-470-16778-5 Includes bibliographical references and index.MODERN ELECTROPLATING; CONTENTS; PREFACE; PREFACE TO THE FOURTH EDITION; CONTRIBUTORS; CONVERSION FACTORS; GRAPHICAL CONVERSIONS; THE ELECTROCHEMICAL SOCIETY SERIES; 1 FUNDAMENTAL CONSIDERATIONS; 2 ELECTRODEPOSITION OF COPPER; 3 ELECTRODEPOSITION OF NICKEL; 4 ELECTRODEPOSITION OF GOLD; 5 ELECTROLESS AND ELECTRODEPOSITION OF SILVER; 6 TIN AND TIN ALLOYS FOR LEAD-FREE SOLDER; 7 ELECTRODEPOSITION OF CHROMIUM; 8 ELECTRODEPOSITION OF LEAD AND LEAD ALLOYS; 9 ELECTRODEPOSITION OF TIN-LEAD ALLOYS; 10 ELECTRODEPOSITION OF ZINC AND ZINC ALLOYS; 11 ELECTRODEPOSITION OF IRON AND IRON ALLOYS12 PALLADIUM ELECTROPLATING13 ELECTROCHEMICAL DEPOSITION PROCESS FOR ULSI INTERCONNECTION DEVICES; 14 ELECTRODEPOSITION OF SEMICONDUCTORS; 15 DEPOSITION ON NONCONDUCTORS; 16 CONDUCTIVE POLYMERS: ELECTROPLATING OF ORGANIC FILMS; 17 ELECTROLESS DEPOSITION OF COPPER; 18 ELECTROLESS DEPOSITION OF NICKEL; 19 ELECTROCHEMICAL SYNTHESIS OF METAL ALLOYS FOR MAGNETIC RECORDING SYSTEMS; 20 ELECTROLESS DEPOSITION OF PALLADIUM AND PLATINUM; 21 ELECTROLESS DEPOSITION OF GOLD; 22 ELECTROLESS DEPOSITION OF ALLOYS; 23 PREPARATION FOR DEPOSITION; 24 MANUFACTURING TOOLS; 25 MONITORING AND CONTROL26 ENVIRONMENTAL ASPECTS OF ELECTRODEPOSITION27 APPLICATIONS TO MAGNETIC RECORDING AND MICROELECTRONIC TECHNOLOGIES; 28 MICROELECTROMECHANICAL SYSTEMS; 29 ANALYSIS OF ELECTROPLATED FILMS USING DUAL-BEAM FIB/SEM AND TEM TECHNIQUES; 30 IONIC LIQUID TREATMENTS FOR ENHANCED CORROSION RESISTANCE OF MAGNESIUM-BASED SUBSTRATES; APPENDIX; INDEX The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical appThe ECS Series of Texts and MonographsElectroplatingMetalsFinishingElectroplating.MetalsFinishing.671.7/32Paunovic Milan563943Schlesinger Mordechay563944MiAaPQMiAaPQMiAaPQBOOK9910826412903321Modern electroplating4050373UNINA