05770nam 2200769Ia 450 991082529730332120200520144314.0978661362063797811199668691119966868978111996367711199636729781280590801128059080797811199632401119963249(CKB)2670000000151527(EBL)865036(OCoLC)778448543(SSID)ssj0000611242(PQKBManifestationID)11368389(PQKBTitleCode)TC0000611242(PQKBWorkID)10646642(PQKB)10604432(MiAaPQ)EBC865036(Au-PeEL)EBL865036(CaPaEBR)ebr10538596(CaONFJC)MIL362063(Perlego)1000805(EXLCZ)99267000000015152720111020d2012 uy 0engur|n|---|||||txtccrAdvanced interconnects for ULSI technology /edited by Mikhail Baklanov, Paul S. Ho and Ehrenfried Zschech2nd ed.Chichester, West Susex Wiley20121 online resource (615 p.)Description based upon print version of record.9780470662540 0470662549 Includes bibliographical references and index.Advanced Interconnects for ULSI Technology; Contents; About the Editors; List of Contributors; Preface; Abbreviations; Section I Low-k Materials; 1 Low-k Materials: Recent Advances; 1.1 Introduction; 1.2 Integration Challenges; 1.2.1 Process-Induced Damage; 1.2.2 Mechanical Properties; 1.3 Processing Approaches to Existing Integration Issues; 1.3.1 Post-deposition Treatments; 1.3.2 Prevention or Repair of Plasma-Induced Processing Damage; 1.3.3 Multilayer Structures; 1.4 Material Advances to Overcome Current Limitations; 1.4.1 Silica Zeolites; 1.4.2 Hybrid Organic-Inorganic: Oxycarbosilanes1.5 ConclusionReferences; 2 Ultra-Low-k by CVD: Deposition and Curing; 2.1 Introduction; 2.2 Porogen Approach by PECVD; 2.2.1 Precursors and Deposition Conditions; 2.2.2 Mystery Still Unsolved: From Porogens to Pores; 2.3 UV Curing; 2.3.1 General Overview of Curing; 2.3.2 UV Curing Mechanisms; 2.4 Impact of Curing on Structure and Physical Properties: Benefits of UV Curing; 2.4.1 Porosity; 2.4.2 Chemical Structure and Mechanical Properties; 2.4.3 Electrical Properties; 2.5 Limit/Issues with the Porogen Approach; 2.5.1 Porosity Creation Limit; 2.5.2 Porogen Residues; 2.6 Future of CVD Low-k2.6.1 New Matrix Precursor2.6.2 Other Deposition Strategies; 2.6.3 New Deposition Techniques; 2.7 Material Engineering: Adaptation to Integration Schemes; 2.8 Conclusion; References; 3 Plasma Processing of Low-k Dielectrics; 3.1 Introduction; 3.2 Materials and Equipment; 3.3 Process Results Characterization; 3.4 Interaction of Low-k Dielectrics with Plasma; 3.4.1 Low-k Etch Chemistries; 3.4.2 Patterning Strategies and Masking Materials; 3.4.3 Etch Mechanisms; 3.5 Mechanisms of Plasma Damage; 3.5.1 Gap Structure Studies; 3.5.2 Effect of Radical Density; 3.5.3 Effect of Ion Energy3.5.4 Effect of Photon Energy and Intensity3.5.5 Plasma Damage by Oxidative Radicals; 3.5.6 Hydrogen-Based Plasma; 3.5.7 Minimization of Plasma Damage; 3.6 Dielectric Recovery; 3.6.1 CH4 Beam Treatment; 3.6.2 Dielectric Recovery by Silylation; 3.6.3 UV Radiation; 3.7 Conclusions; References; 4 Wet Clean Applications in Porous Low-k Patterning Processes; 4.1 Introduction; 4.2 Silica and Porous Hybrid Dielectric Materials; 4.3 Impact of Plasma and Subsequent Wet Clean Processes on the Stability of Porous Low-k Dielectrics; 4.3.1 Stability in Pure Chemical Solutions4.3.2 Stability in Commercial Chemistries4.3.3 Hydrophobicity of Hybrid Low-k Materials; 4.4 Removal of Post-Etch Residues and Copper Surface Cleaning; 4.5 Plasma Modification and Removal of Post-Etch 193 nm Photoresist; 4.5.1 Modification of 193 nm Photoresist by Plasma Etch; 4.5.2 Wet Removal of 193 nm Photoresist; Acknowledgments; References; Section II Conductive Layers and Barriers; 5 Copper Electroplating for On-Chip Metallization; 5.1 Introduction; 5.2 Copper Electroplating Techniques; 5.3 Copper Electroplating Superfill; 5.3.1 The Role of Accelerator; 5.3.2 The Role of Suppressor5.3.3 The Role of LevelerFinding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical Integrated circuitsUltra large scale integrationInterconnects (Integrated circuit technology)Integrated circuitsUltra large scale integration.Interconnects (Integrated circuit technology)621.39/5TEC008050bisacshBaklanov Mikhail1628643Ho P. S1676329Zschech Ehrenfried950028MiAaPQMiAaPQMiAaPQBOOK9910825297303321Advanced interconnects for ULSI technology4042447UNINA03213nam 22006135 450 991037782330332120200704182130.03-030-35012-610.1007/978-3-030-35012-3(CKB)4100000010348973(DE-He213)978-3-030-35012-3(MiAaPQ)EBC6038342(PPN)24298035X(EXLCZ)99410000001034897320200205d2020 u| 0engurnn|008mamaatxtrdacontentcrdamediacrrdacarrierActive Balancing of Bike Sharing Systems /by Jan Brinkmann1st ed. 2020.Cham :Springer International Publishing :Imprint: Springer,2020.1 online resource (XXI, 184 p. 48 illus., 1 illus. in color.) Lecture Notes in Mobility,2196-55443-030-35011-8 Introduction -- Bike Sharing Systems -- Optimization Problems -- Dynamic Decision Making -- The Stochastic-Dynamic Multi-Vehicle Inventory Routing Problem for Bike Sharing Systems -- Lookahead Policies -- Dynamic Lookahead Horizons -- Case Studies -- Managerial Implications -- Future Research.This book reports on an operational management approach to improving bike-sharing systems by compensating for fluctuating demand patterns. The aim is to redistribute bikes within the system, allowing it to be “actively” balanced. The book describes a mathematical model, as well as data-driven and simulation-based approaches. Further, it shows how these elements can be combined in a decision-making support system for service providers. In closing, the book uses real-world data to evaluate the method developed and demonstrates that it can successfully anticipate changes in demand, thus supporting efficient scheduling of transport vehicles to manually relocate bikes between stations.Lecture Notes in Mobility,2196-5544Transportation engineeringTraffic engineeringAutomatic controlOperations researchDecision makingTransportation Technology and Traffic Engineeringhttps://scigraph.springernature.com/ontologies/product-market-codes/T23120Control and Systems Theoryhttps://scigraph.springernature.com/ontologies/product-market-codes/T19010Operations Research/Decision Theoryhttps://scigraph.springernature.com/ontologies/product-market-codes/521000Transportation engineering.Traffic engineering.Automatic control.Operations research.Decision making.Transportation Technology and Traffic Engineering.Control and Systems Theory.Operations Research/Decision Theory.388.3472Brinkmann Janauthttp://id.loc.gov/vocabulary/relators/aut1062643MiAaPQMiAaPQMiAaPQBOOK9910377823303321Active Balancing of Bike Sharing Systems2527198UNINA