04206nam 2200625Ia 450 991082305110332120200520144314.01-280-63092-297866106309290-08-045562-X(CKB)1000000000358059(EBL)269949(OCoLC)476000281(SSID)ssj0000102902(PQKBManifestationID)11127527(PQKBTitleCode)TC0000102902(PQKBWorkID)10061000(PQKB)11064467(Au-PeEL)EBL269949(CaPaEBR)ebr10138376(CaONFJC)MIL63092(OCoLC)162130017(MiAaPQ)EBC269949(EXLCZ)99100000000035805920050214d2005 fy 0engurcn|||||||||txtccrAnalysis and design principles of MEMS devices /by Minhang Bao1st ed.Amsterdam ;Oxford Elsevierc20051 online resource (327 p.)Description based upon print version of record.0-444-51616-6 Includes bibliographical references and index.Front Cover; Analysis and Design Principles of MEMS Devices; Copyright Page; Preface; Contents; Summary; Chapter 1. Introduction to MEMS devices; 1.1. Piezoresistive pressure sensor; 1.2. Piezoresistive Accelerometer; 1.3. Capacitive Pressure Sensor, Accelerometer and Microphone; 1.4. Resonant Sensor and Vibratory Gyroscope; 1.5. Micro Mechanical Electric and Optical Switches; 1.6. Micro Mechanical Motors; 1.7. Micro Electro Mechanical Systems; 1.8. Analysis and Design principles of MEMS Devices; References; Chapter 2. Mechanics of beam and diaphragm structures2.1. Stress and Strain 2.2. Stress and Strain of Beam Structures; 2.3. Vibration Frequency by Energy Method; 2.4. Vibration Modes and the Buckling of a Beam; 2.5. Damped and forced vibration; 2.6. Basic Mechanics of Diaphragms; 2.7. Problems; References; Chapter 3. Air Damping; 3.1. Drag Effect of a Fluid; 3.2. Squeeze-film Air Damping; 3.3. Damping of Perforated Thick Plates; 3.4. Slide-film Air Damping; 3.5. Damping in Rarefied Air; 3.6. Problems; References; Chapter 4. Electrostatic Actuation; 4.1. Electrostatic Forces; 4.2. Electrostatic Driving of Mechanical Actuators4.3. Step and Alternative Voltage Driving 4.4. Problems; References; Chapter 5. Capacitive Sensing and Effects of Electrical Excitation; 5.1. Capacitive Sensing Schemes; 5.2. Effects of Electrical Excitation - Static Signal; 5.3. Effects of Electrical Excitation - Step Signal; 5.4. Effects of Electrical Excitation - Pulse Signal; 5.5. Problems; References; Chapter 6. Piezoresistive Sensing; 6.1. Piezoresistance Effect in Silicon; 6.2. Coordinate Transformation of Second Rank Tensors; 6.3.Coordinate Transformation of Piezoresistive Coefficient; 6.4. Piezoresistive Sensing Elements6.5. Polysilicon Piezoresistive Sensing Elements6.6. Analyzing Piezoresistive Bridge; 6.7. Problems; References; Answers to the Problems; Subject IndexSensors and actuators are now part of our everyday life and appear in many appliances, such as cars, vending machines and washing machines. MEMS (Micro Electro Mechanical Systems) are micro systems consisting of micro mechanical sensors, actuators and micro electronic circuits. A variety of MEMS devices have been developed and many mass produced, but the information on these is widely dispersed in the literature. This book presents the analysis and design principles of MEMS devices. The information is comprehensive, focusing on microdynamics, such as the mechanics of beam and diaphragm structuMicroelectromechanical systemsMicrotechnologyMicroelectromechanical systems.Microtechnology.621.381Bao Min-Hang627427MiAaPQMiAaPQMiAaPQBOOK9910823051103321Analysis and design principles of MEMS devices1212878UNINA