05993nam 22007573u 450 991081721840332120240514070624.01-299-31442-20-470-82782-30-470-82781-5(CKB)3280000000000225(EBL)818629(OCoLC)756280855(SSID)ssj0000565672(PQKBManifestationID)11367216(PQKBTitleCode)TC0000565672(PQKBWorkID)10532903(PQKB)10684069(MiAaPQ)EBC818629(EXLCZ)99328000000000022520130418d2011|||| u|| |engur|n|---|||||txtccrModeling and Simulation for Microelectronic Packaging Assembly[electronic resource] Manufacturing, Reliability and Testing1st ed.Chicester Wiley20111 online resource (588 p.)Description based upon print version of record.0-470-82780-7 Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing; Contents; Foreword by C. P. Wong; Foreword by Zhigang Suo; Preface; Acknowledgments; About the Authors; Part I: Mechanics and Modeling; 1 Constitutive Models and Finite Element Method; 1.1 Constitutive Models for Typical Materials; 1.1.1 Linear Elasticity; 1.1.2 Elastic-Visco-Plasticity; 1.2 Finite Element Method; 1.2.1 Basic Finite Element Equations; 1.2.2 Nonlinear Solution Methods; 1.2.3 Advanced Modeling Techniques in Finite Element Analysis1.2.4 Finite Element Applications in Semiconductor Packaging Modeling1.3 Chapter Summary; References; 2 Material and Structural Testing for Small Samples; 2.1 Material Testing for Solder Joints; 2.1.1 Specimens; 2.1.2 A Thermo-Mechanical Fatigue Tester; 2.1.3 Tensile Test; 2.1.4 Creep Test; 2.1.5 Fatigue Test; 2.2 Scale Effect of Packaging Materials; 2.2.1 Specimens; 2.2.2 Experimental Results and Discussions; 2.2.3 Thin Film Scale Dependence for Polymer Thin Films; 2.3 Two-Ball Joint Specimen Fatigue Testing; 2.4 Chapter Summary; References3 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution3.1 Constitutive Model for Tin-Lead Solder Joint; 3.1.1 Model Formulation; 3.1.2 Determination of Material Constants; 3.1.3 Model Prediction; 3.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills; 3.2.1 Constitutive Modeling of Underfills; 3.2.2 Identification of Material Constants; 3.2.3 Model Verification and Prediction; 3.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys; 3.3.1 Damage Coupling Thermodynamic Framework3.3.2 Large Deformation Formulation3.3.3 Identification of the Material Parameters; 3.3.4 Creep Damage; 3.4 User-Supplied Subroutines for Solders Considering Damage Evolution; 3.4.1 Return-Mapping Algorithm and FEA Implementation; 3.4.2 Advanced Features of the Implementation; 3.4.3 Applications of the Methodology; 3.5 Chapter Summary; References; 4 Accelerated Fatigue Life Assessment Approaches for Solders in Packages; 4.1 Life Prediction Methodology; 4.1.1 Strain-Based Approach; 4.1.2 Energy-Based Approach; 4.1.3 Fracture Mechanics-Based Approach; 4.2 Accelerated Testing Methodology4.2.1 Failure Modes via Accelerated Testing Bounds4.2.2 Isothermal Fatigue via Thermal Fatigue; 4.3 Constitutive Modeling Methodology; 4.3.1 Separated Modeling via Unified Modeling; 4.3.2 Viscoplasticity with Damage Evolution; 4.4 Solder Joint Reliability via FEA; 4.4.1 Life Prediction of Ford Joint Specimen; 4.4.2 Accelerated Testing: Insights from Life Prediction; 4.4.3 Fatigue Life Prediction of a PQFP Package; 4.5 Life Prediction of Flip-Chip Packages; 4.5.1 Fatigue Life Prediction with and without Underfill4.5.2 Life Prediction of Flip-Chips without Underfill via Unified and Separated Constitutive ModelingAlthough there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming ""test and try out"" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow peopleMicroelectronic packaging - Simulation methodsMicroelectronic packaging -- Simulation methodsTECHNOLOGY & ENGINEERING / Electronics / Circuits / GeneralTECHNOLOGY & ENGINEERING / Electronics / Circuits / GeneralMicroelectronic packagingSimulation methodsElectrical & Computer EngineeringHILCCEngineering & Applied SciencesHILCCElectrical EngineeringHILCCMicroelectronic packaging - Simulation methods.Microelectronic packaging -- Simulation methods.TECHNOLOGY & ENGINEERING / Electronics / Circuits / General.TECHNOLOGY & ENGINEERING / Electronics / Circuits / General.Microelectronic packagingSimulation methods.Electrical & Computer EngineeringEngineering & Applied SciencesElectrical Engineering621.381046TEC008010bisacshLiu Sheng1631847Liu Yong720834AU-PeELAU-PeELAU-PeELBOOK9910817218403321Modeling and Simulation for Microelectronic Packaging Assembly3970668UNINA