02515nam 2200649 a 450 991081501690332120240514074823.03-527-64423-71-280-66282-497866136397523-527-64422-93-527-64424-5(CKB)2550000000082805(EBL)822735(OCoLC)775301857(SSID)ssj0000636248(PQKBManifestationID)11367416(PQKBTitleCode)TC0000636248(PQKBWorkID)10660850(PQKB)10156491(MiAaPQ)EBC822735(Au-PeEL)EBL822735(CaPaEBR)ebr10529302(CaONFJC)MIL363975(EXLCZ)99255000000008280520120218d2012 uy 0engur|n|---|||||txtccrHandbook of wafer bonding /edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo1st ed.Weinheim, Germany Wiley-VCH20121 online resource (430 p.)Description based upon print version of record.3-527-32646-4 Includes bibliographical references and index.pt. 1. Technologies -- pt. 2. Applications.Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.SemiconductorsBondingHandbooks, manuals, etcSemiconductor wafersMicroelectromechanical systemsDesign and constructionSemiconductorsBondingSemiconductor wafers.Microelectromechanical systemsDesign and construction.621.38152Ramm Peter1615375Lu James Jian-Qiang1625879Taklo Maaike M. V1625880MiAaPQMiAaPQMiAaPQBOOK9910815016903321Handbook of wafer bonding3961605UNINA