01450nam 2200457 450 991079471720332120230808205659.03-7369-8410-3(CKB)4340000000197035(MiAaPQ)EBC5019054(OCoLC)1003262196(EXLCZ)99434000000019703520170927h20162016 uy 0engurcnu||||||||rdacontentrdamediardacarrierDevelopment of sub-mm wave flip-chip interconnect /Sirinpa Monayakul1st edition.Gottingen, Germany :Cuvillier Verlag,2016.©20161 online resource (142 pages) illustrations (some color)Innovationen mit Mikrowellen und Licht. Forschungsberichte aus dem Ferdinand-Braun-Institut, Leibniz-Institut fur Hochstfrequenztechnik ;Band 383-7369-9410-9 Includes bibliographical references.Gold alloysEutectic alloysFlip chip technologyGold alloys.Eutectic alloys.Flip chip technology.600Monayakul Sirinpa1502657MiAaPQMiAaPQMiAaPQBOOK9910794717203321Development of sub-mm wave flip-chip interconnect3730521UNINA