04709nam 2200613Ia 450 991079183400332120200520144314.01-61761-868-3(CKB)2560000000067914(EBL)3018132(SSID)ssj0000420663(PQKBManifestationID)11283852(PQKBTitleCode)TC0000420663(PQKBWorkID)10393675(PQKB)10596523(MiAaPQ)EBC3018132(Au-PeEL)EBL3018132(CaPaEBR)ebr10659054(OCoLC)923657270(EXLCZ)99256000000006791420090210d2009 uy 0engur|n|---|||||txtccrIntegrated circuits, photodiodes and organic field effect transistors[electronic resource] /Robert McIntire and Pierre Donnell, editorsNew York Nova Science Publishersc20091 online resource (458 p.)Environmental Research AdvancesDescription based upon print version of record.1-60692-660-8 Includes bibliographical references and index.""INTEGRATED CIRCUITS,PHOTODIODES AND ORGANIC FIELDEFFECT TRANSISTORS""; ""CONTENTS""; ""PREFACE""; ""RESEARCH AND REVIEW STUDIES""; ""METAMATERIALS TECHNOLOGY: APPLICATIONTO RADIOFREQUENCY AND MICROWAVE CIRCUITS""; ""ABSTRACT""; ""1. INTRODUCTION TO METAMATERIALS""; ""2. METAMATERIALS IN PLANAR TECHNOLOGY:METAMATERIAL TRANSMISSION LINES""; ""2.1. The Dual Transmission Line Concept""; ""2.2. CL-Loaded Lines: The Composite Right/Left Handed TransmissionLine Concept""; ""2.3. Resonant Type Metamaterial Transmission Lines""; ""3. APPLICATIONS OF METAMATERIAL TRANSMISSION LINES""""3.1. Metamaterial Filters""""3.1.1. Stop Band Filters: Application to Spurious Suppression in ConventionalFilters""; ""3.1.2. Narrow Band Pass Filters and Diplexers""; ""3.1.3. Wide and Ultra Wide Band (UWB) Pass Filters""; ""3.1.4. Metamaterial Based Filters Subjected to Standard Responses:A Design Methodology""; ""3.2. Enhanced Bandwidth Components""; ""3.3. Multiband Components""; ""4. CONCLUSION""; ""REFERENCES""; ""RELIABILITY ASSESSMENT OF INTEGRATEDCIRCUITS AND ITS MISCONCEPTION""; ""ABSTRACT""; ""I. THE IMPORTANCE OF INTEGRATED CIRCUIT RELIABILITY""""II. COMMON RELIABILITY PRACTICES IN INTEGRATEDCIRCUIT INDUSTRY""""1. Process Reliability Test in Wafer Fabrication Manufacturers""; ""2. Product Reliability Tests in IC Assembly and Packaging Manufacturers""; ""3. Highly Accelerated Stress Test (HAST)""; ""III. MISCONCEPTIONS IN COMMON RELIABILITY ASSESSMENTOF INTEGRATED CIRCUITS""; ""1. Zero Failure Represents Good Reliability""; ""2. Higher MTTF Represents Better Reliability""; ""3. MTTF Is the Mean Failure Time""; ""4. Exponential Distribution Is Sufficient to Analyze the Test Data""""5. The Higher the Stress, the More Effective Is the Reliability Test""""A. Masked Failure Mechanism""; ""B. Variation of Failure Mechanism""; ""6. All Test Data Are Valid""; ""7. Only One Failure Mechanism Exist in the Failed Units""; ""8. Probability Plot Is Sufficient for Test Data Analysis""; ""9. Small Sample Size Is Sufficient""; ""10. The Important of Confidence Interval""; ""IV. CONCLUSION""; ""REFERENCES""; ""DESIGN OF A MULTICHANNEL INTEGRATEDBIOSENSOR CHIP AND MICROELECTRONIC SYSTEMFOR EXTRACELLULAR NEURAL RECORDING""; ""ABSTRACT""; ""1. INTRODUCTION""; ""2. SYSTEM OVERVIEW""""3. SYSTEM ARCHITECTURE AND DESIGN""""3.1. Neural Signal Input""; ""3.2. Preamplifier Buffers""; ""3.3. Analysis and Design of the Two-Stage Amplifier BasedPreamplifier Buffer""; ""3.3.1. Device Model""; ""3.3.2. Frequency Response and Pole/Zero Locations""; ""3.3.3. Output Swing""; ""3.3.4. Common-Mode Input Range""; ""3.3.5. Internal Slew Rate""; ""3.3.6. External Slew Rate""; ""3.3.7. Systematic Input-Referred Offset Voltage Minimization""; ""3.3.8. Input-Referred Thermal Noise""; ""3.3.9. Preamplifier Buffer Design""; ""3.4. Channels Addressing and Sequencing""""3.5. Biasing Circuitry""Environmental Research AdvancesDiodesOrganic field-effect transistorsDiodes.Organic field-effect transistors.621.3815McIntire Robert1520221Donnell Pierre1520222MiAaPQMiAaPQMiAaPQBOOK9910791834003321Integrated circuits, photodiodes and organic field effect transistors3758764UNINA