03330nam 2200613Ia 450 991078353950332120230828225729.01-280-54757-X97866105475791-84663-011-8(CKB)1000000000242843(EBL)267393(OCoLC)71174790(SSID)ssj0000671747(PQKBManifestationID)11384635(PQKBTitleCode)TC0000671747(PQKBWorkID)10625146(PQKB)11705436(MiAaPQ)EBC267393(Au-PeEL)EBL267393(CaPaEBR)ebr10132649(CaONFJC)MIL54757(OCoLC)133162498(EXLCZ)99100000000024284320000815d2006 uy 0engur|n|---|||||txtccrAdvanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging[electronic resource] /guest editors Christopher Bailey and Johan LiuBradford, England Emerald Group Publishingc20061 online resource (72 p.)Soldering & surface mount technology ;v.18, no. 2Description based upon print version of record.1-84663-010-X Cover; Contents; Guest editorial; Coffin-Manson constant determination for a Sn-8Zn-3Bi lead-free solder joint; High strain rate testing of solder interconnections; Intermetallic compound formation and diffusion path evolution in eutectic tin-lead flip chip solder bumps after aging; Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly; High performance anisotropic conductive adhesives for lead-free interconnects; Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy-based binderFinite element analysis of fleXBGA reliabilityInternet commentary; Book review; New products; Industry news; Exhibitions and conferences; Appointments; International diaryThis issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key iSoldering & surface mount technology ;v.18, no. 2.Manufacturing processesElectronic packagingManufacturing processes.Electronic packaging.621.381/046Bailey Christopher1469364Liu Johan1469365MiAaPQMiAaPQMiAaPQBOOK9910783539503321Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging3680831UNINA