04232nam 2200577Ia 450 991077953850332120230126203313.00-8262-7290-8(CKB)2550000001039461(EBL)3440825(SSID)ssj0001037033(PQKBManifestationID)12385253(PQKBTitleCode)TC0001037033(PQKBWorkID)11042722(PQKB)10958158(MiAaPQ)EBC3440825(OCoLC)846986119(MdBmJHUP)muse26968(Au-PeEL)EBL3440825(CaPaEBR)ebr10678890(EXLCZ)99255000000103946120130417d2012 uy 0engurcn|||||||||txtccrFrom Missouri[electronic resource] an American farmer looks back /Thad Snow ; edited by Bonnie StepenoffColumbia University of Missouri Pressc20121 online resource (352 p.)Issued in 2012 with a new introduction by Bonnie Stepenoff; originally published in 1954 by Houghton Mifflin, Boston.Includes index.0-8262-1990-X Includes bibliographical references and index.After years of subjecting the editors of St. Louis newspapers to eloquent letters on subjects as diverse as floods, tariffs, and mules, Thad Snow published his memoir From Missouri in his mid-seventies in 1954. He was barely retired from farming for more than half a century, mostly in the Missouri Bootheel, or "Swampeast Missouri," as he called it. Now back in print with a new introduction by historian Bonnie Stepenoff, these sketches of a life, a region, and an era will delight readers new to this distinctive American voice as well as readers already familiar with this masterpiece of the American Midwest. Snow purchased a thousand acres of southeast Missouri swampland in 1910, cleared it, drained it, and eventually planted it in cotton. Although he employed sharecroppers, he grew to become a bitter critic of the labor system after a massive flood and the Great Depression worsened conditions for these already-burdened workers. Shocking his fellow landowners, Snow invited the Southern Tenant Farmers Union to organize the workers on his land. He was even once accused of fomenting a strike and publicly threatened with horsewhipping. Snow's admiration for Owen Whitfield, the African American leader of the Sharecroppers' Roadside Demonstration, convinced him that nonviolent resistance could defeat injustice. Snow embraced pacifism wholeheartedly and denounced all war as evil even as America mobilized for World War II after the attack on Pearl Harbor. In the late 1940's and early 1950's, he became involved with creating Missouri's conservation movement. Near the end of his life, he found a retreat in the Missouri Ozarks, where he wrote this recollection of his life. This unique and honest series of personal essays expresses the thoughts of a farmer, a hunter, a husband, a father and grandfather, a man with a soft spot for mules and dogs and all kinds of people. Snow's prose reveals much about a way of life in the region during the first half of the twentieth century, as well as the social and political events that affected the entire nation. Whether arguing that a good stock dog should be left alone to do its work, explaining the process of making swampland suitable for agriculture, or putting forth his case for world peace, Snow's ideas have a special authenticity because they did not come from an ivory tower or a think tank--they came From Missouri .FarmersBiographyFarmersMissouriBiographyMissouriSocial life and customs20th centuryMissouriSocial conditions20th centuryFarmersBiography.FarmersBiography.630.92Snow Thad1881-1954.1461966Stepenoff Bonnie1949-1113323MiAaPQMiAaPQMiAaPQBOOK9910779538503321From Missouri3670816UNINA05290nam 2200637Ia 450 991082998010332120230422044854.01-281-76426-497866117642653-527-61378-13-527-61379-X(CKB)1000000000376216(EBL)482119(SSID)ssj0000149737(PQKBManifestationID)11147466(PQKBTitleCode)TC0000149737(PQKBWorkID)10239622(PQKB)11789716(MiAaPQ)EBC482119(OCoLC)212131961(EXLCZ)99100000000037621619990621d1999 uy 0engur|n|---|||||txtccrEtching in microsystem technology[electronic resource] /Michael Köhler ; translated by Antje WiegandWeinheim ;New York Wiley-VCHc19991 online resource (386 p.)Description based upon print version of record.3-527-29561-5 Includes bibliographical references ([345]-360) and index.Etching in Microsystem Technology; Preface; Contents; Table of Contents; Symbols; Abbreviations; 1 Introduction; 2 Distinctive Features of Microtechnical Etching; 2.1 Etching as a Fashioning Method; 2.1.1 Limits of Additive Microtechnical Pattern Generation; 2.1.2 Subtractive Pattern Generation; 2.2 Etch Rate and Selectivity; 2.2.1 Etch Rate and Time Request; 2.2.2 The Etching Process; 2.2.3 Transport Processes; 2.2.4 Process Velocities; 2.3. Isotropic and Anisotropic Etching; 2.4 Edge Geometry and Roughness; 2.4.1 Deviations from Ideal Geometry; 2.4.2 Flank Geometry in Isotropic Etching2.4.3 Fabrication of Low Slope Angles by Isotropic Etching2.4.4 Flank Geometries in Anisotropic Etching; 2.4.5 Setting the Flank Geometry by Partial Anisotropic Etching; 2.5 Accuracy; 2.6 Monitoring of Etching Processes; 3 Wet-Chemical Etching Methods; 3.1 Etching at the Interface Solid-Liquid; 3.2 Preparation of the Surface; 3.2.1 Surface Condition; 3.2.2 Cleaning; 3.2.3 Digital Etching; 3.3 Etching of Dielectric Materials; 3.3.1 Wet Etching by Physical Dissolution; 3.3.2 Wet-Chemical Etching of Non-Metals; 3.4 Etching of Metals and Semiconductors; 3.4.1 Outer-Currentless Etching3.4.2 Selectivity in Outer-Currentless Etching3.4.3 Etching of Multilayer Systems Forming Local Elements; 3.4.4 Geometry-Dependent Etch Rates; 3.4.5 Geometry-Dependent Passivation; 3.4.6 Electrochemical Etching; 3.4.7 Photochemical Wet Etching; 3.4.8 Photoelectrochemical Etching(PEC); 3.5 Crystallographic Etching; 3.5.1 Chemical Wet-Etching of Monocrystalline Surfaces; 3.5.2 Anisotropic Etching of Monocrystalline Metals; 3.5.3 Anisotropic Etching of Silicon; 3.5.4 Anisotropic Electrochemical and Photoelectrochemical Etching; 3.5.5 Porous Silicon3 S.6 Anisotropic Etching of Compound Semiconductors3.6 Preparation of Free-Standing Micropatterns; 3.6.1 Surface Micromachining; 3.6.2 Bulk Micromachining; 3.6.3 Porous Silicon as Sacrificial Material; 4 Dry-Etching Methods; 4.1 Removal at the Interface Solid-Gas; 4.2 Plasma-Free Etching in the Gas Phase; 4.2.1 Plasma-Free Dry-Etching with Reactive Gases; 4.2.2 Photo-Assisted Dry Etching with Reactive Gases; 4.2.3 Directly Writing Micropatterning by Laser Scanning Etching; 4.2.4 Electron-Beam-Assisted Vapour Etching; 4.3 Plasma Etching Methods4.3.1 Material Removal by Reactions with Plasma Species4.3.2 Plasma Generation; 4.3.3 Plasma Etching in the Barrel Reactor; 4.3.4 Plasma Etching in the Down-Stream Reactor; 4.3.5 Plasma Etching in the Planar-Plate Reactor; 4.3.6 Magnetic-Field-Enhanced Plasma Etching; 4.3.7 Plasma Etching at Low Pressure and High Ion Density; 4.3.8 Forming of Etch Structures in Plasma Etching; 4.3.9 Geometry Influence on Plasma Etching; 4.3.10 Plasma Jet Etching (PJE); 4.3.11 Applications of Plasma Etching; 4.4 Etchig Methods with Energized Particles; 4.4.1 Sputter-Etching; 4.4.2 Reactive Ion Etching (RIE)4.4.3 Magnetic-Field-Enhanced Reactive Ion Etching (MERIE)Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these materials, and their treatment. The precise patterning of various materials, which is normally performed by lithographic etching processes, is a prerequisite for the fabrication of microdevices.The microtechnical etching of functional patterns is a multidisciplinary area, the basis for the etching pMasks (Electronics)MicrolithographyPlasma etchingMasks (Electronics)Microlithography.Plasma etching.621.381531660Köhler J. M(J. Michael),1956-427318MiAaPQMiAaPQMiAaPQBOOK9910829980103321Etching in microsystem technology4014444UNINA