01657nam 2200445 450 991073538880332120221227213134.03-030-98229-7(MiAaPQ)EBC7023523(Au-PeEL)EBL7023523(CKB)24094359900041(EXLCZ)992409435990004120221227d2022 uy 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrier3D interconnect architectures for heterogeneous technologies modeling and optimization /Lennart Bamberg [and three others]Cham, Switzerland :Springer,[2022]©20221 online resource (403 pages)Print version: Bamberg, Lennart 3D Interconnect Architectures for Heterogeneous Technologies Cham : Springer International Publishing AG,c2022 9783030982287 Includes bibliographical references (pages 383-395).Three-dimensional interconnect architectures for heterogeneous technologiesInterconnects (Integrated circuit technology)Systems on a chipThree-dimensional integrated circuitsInterconnects (Integrated circuit technology)Systems on a chip.Three-dimensional integrated circuits.621.3815Bamberg Lennart1376503MiAaPQMiAaPQMiAaPQBOOK99107353888033213D interconnect architectures for heterogeneous technologies3412364UNINA