03535nam 22005535 450 991072008000332120250417111722.09783031267086(electronic bk.)978303126707910.1007/978-3-031-26708-6(MiAaPQ)EBC7242925(Au-PeEL)EBL7242925(DE-He213)978-3-031-26708-6(OCoLC)1378389907(PPN)269655913(CKB)26540727900041(EXLCZ)992654072790004120230428d2023 u| 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierInterconnect Reliability in Advanced Memory Device Packaging /by Chong Leong, Gan, Chen-Yu, Huang1st ed. 2023.Cham :Springer International Publishing :Imprint: Springer,2023.1 online resource (223 pages)Springer Series in Reliability Engineering,2196-999XPrint version: Gan, Chong Leong Interconnect Reliability in Advanced Memory Device Packaging Cham : Springer International Publishing AG,c2023 9783031267079 Chapter 1: Advanced Memory and Device Packaging -- Chapter 2: Wearout Reliability-based Characterization in Memory Packaging -- Chapter 3: Recycling of Noble Metals Used in Memory Packaging -- Chapter 4: Advanced Flip Chip Packaging -- Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD) -- Chapter 6: Specific Packaging Reliability Testing -- Chapter 7: Reliability Simulation and Modeling in Memory Packaging -- Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications.This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.Springer Series in Reliability Engineering,2196-999XComputersElectronic circuitsHardware Performance and ReliabilityElectronic Circuits and SystemsComputers.Electronic circuits.Hardware Performance and Reliability.Electronic Circuits and Systems.929.605Gan Chong Leong1355814Huang Chen-YuMiAaPQMiAaPQMiAaPQ9910720080003321Interconnect Reliability in Advanced Memory Device Packaging3359884UNINA01720nam0 2200397 i 450 URB035889820251003044433.08814098980IT2003-12281 20060223d2003 ||||0itac50 baitaitz01i xxxe z01nz01ncRDAcarrierResponsabilità per fatto degli ausiliariclausole di esonero da responsabilità[artt. 1228-1229]Grazia CeccheriniMilanoGiuffrè2003XIV, 263 p.25 cm.ˆIl ‰Codice civile. Commentario001CFI00513082001 ˆIl ‰Codice civile. CommentarioResponsabilità civileClausole esonerativeFIRUFIC103550IResponsabilità civileClausole esonerativeFIRUFIC103550I345.450268REATI COMMERCIALI, FINANZIARI, PROFESSIONALI. ITALIA21346.45DIRITTO PRIVATO. ITALIA21346.4503ILLECITI. ITALIA21347Diritto processuale civile e tribunali civili12Ceccherini, GraziaCFIV103264070149600ITIT-00000020060223IT-BN0095 IT-NA0079 IT-NA0070 NAP 01COM $NAP BNS.MOD La consegna dei documenti è effettuata dall'Ufficio DistribuzioneURB0358898Biblioteca Centralizzata di Ateneo 01COM (C) 346.45 COM SCH 01C 0080010475 VMA 1 v.B 2013062020130620 01 BNResponsabilità per fatto degli ausiliari68700UNISANNIO