01405oam 2200421I 450 991070260390332120150806133206.0(CKB)5470000002430155(OCoLC)227941243(EXLCZ)99547000000243015520080513d2007 ua 0engurcn|||||||||txtrdacontentcrdamediacrrdacarrierFlip chip hybridization using indium bump technology at ARL /Kimberley A. OlverAdelphi. MD :Army Research Laboratory,[2007]1 online resource (iv, 8 pages) color illustrationsTitle from title screen (viewed on Aug. 4, 2015)."July 2007.""ARL-TN-283."Includes bibliographical references (page 5).Flip chip hybridization using indium bump technology at Army Research LaboratoryMicroelectronicsIntegrated circuitsWeldingMicroelectronics.Integrated circuitsWelding.Olver Kimberley A.1397178U.S. Army Research Laboratory,DTICEDTICEOCLCQGPOBOOK9910702603903321Flip chip hybridization using indium bump technology at ARL3458528UNINA