01378cam a2200229 i 4500991000696959707536100421m18761897it ita db1389724x-39ule_instDip.to Studi GiuridiciitaRepertorio generale di giurisprudenza civile, penale, commerciale ed amministrativa del Regno dall'anno dell'unificazione legislativa (1866) a tutto il 1893.Quarto supplemento : anni 1889-1993.Vol. 1.: A-D /iniziato da Emidio Pacifici-Mazzoni, continuato da Samuele Coen ; colla collaborazione degli avvocati Anau Flaminio, Baudana-Vaccolini Cesare ... [et al.]Torino :Unione Tipografico-Editrice,1897 v. ;29 cm.GiurisprudenzaRepertori1889-1893Baudana-Vaccolini, CesarePacifici-Mazzoni, Emidio<1834-1880>authorhttp://id.loc.gov/vocabulary/relators/aut227727Coen, Samuel.b1389724x28-01-1421-04-10991000696959707536LE027 F/A II D PAC01.0212027000302390le027pE40.00-n- 00000.i1511559821-04-10Repertorio generale di giurisprudenza civile, penale, commerciale ed amministrativa del Regno dall'anno dell'unificazione legislativa (1866) a tutto il 18931440832UNISALENTOle02721-04-10ma -itait 0002046nam 2200349 450 991068838050332120230630102714.010.5772/intechopen.76955(CKB)5400000000045963(NjHacI)995400000000045963(EXLCZ)99540000000004596320230630d2019 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrierLead Free Solders /edited by Abhijit KarLondon :IntechOpen,2019.1 online resource (94 pages) illustrations1-83962-278-4 This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.Solder and solderingSolder and soldering.671.56Kar AbhijitNjHacINjHaclBOOK9910688380503321Lead Free Solders2081909UNINA