00869cam2 22002531 450 SOBE0006481620250401095430.020201112d1962 |||||ita|0103 baitaIT<<1: >>Evo anticoPaolo BrezziMilanoMarzorati1962VIII, 766 p.25 cm001E6002000300502001 Fonti e studi di storia della Chiesa : testi, traduzioni e bibliografia : note e bibliografia / Paolo BrezziBrezzi, PaoloA600200024968070318494ITUNISOB20250401RICAUNISOBUNISOB90011655SOBE00064816M 102 Monografia moderna SBNM900002966-1SI11655rovitoUNISOBUNISOB20201112095448.020250401095430.0bethbEvo antico1760989UNISOB04659nam 22006375 450 991063109250332120251009105826.09783031172076(electronic bk.)978303117206910.1007/978-3-031-17207-6(MiAaPQ)EBC7141553(Au-PeEL)EBL7141553(CKB)25360910800041(OCoLC)1351202970(PPN)266349196(DE-He213)978-3-031-17207-6(EXLCZ)992536091080004120221116d2022 u| 0engurcnu||||||||txtrdacontentcrdamediacrrdacarrierAdvanced Materials and Components for 5G and Beyond /by Colin Tong1st ed. 2022.Cham :Springer Nature Switzerland :Imprint: Springer,2022.1 online resource (276 pages)Springer Series in Materials Science,2196-2812 ;327Print version: Tong, Colin Advanced Materials and Components for 5G and Beyond Cham : Springer,c2022 9783031172069 Includes bibliographical references and index.Chapter 1. 5G technology components and material solutions for hardware system integration -- Chapter 2. Semiconductor solutions for 5G -- Chapter 3. Design and performance enhancement for 5G antennas and beamforming integrated circuits -- Chapter 4. PCB materials and design requirements for 5G systems -- Chapter 5. Materials for high frequency filters -- Chapter 6. EMI shielding materials and absorbers for 5G communications -- Chapter 7. Thermal management materials and components for 5G devices -- Chapter 8. Protective packaging and sealing materials for 5G mobile devices -- Chapter 9. Perspectives on 5G and beyond applications and related technologies.This book provides a comprehensive introduction to the current status and future trends of materials and component design for fifth-generation (5G) wireless communications and beyond. Necessitated by rapidly increasing numbers of mobile devices and data volumes, and acting as a driving force for innovation in information technology, 5G networks are broadly characterized by ubiquitous connectivity, extremely low latency, and very high-speed data transfer. Such capabilities are facilitated by nanoscale and massive multi-input multi-output (MIMO) with extreme base station and device densities, as well as unprecedented numbers of antennas. This book covers semiconductor solutions for 5G electronics, design and performance enhancement for 5G antennas, high frequency PCB materials and design requirements, materials for high frequency filters, EMI shielding materials and absorbers for 5G systems, thermal management materials and components, and protective packaging and sealing materials for 5G devices. It explores fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications of 5G-and-beyond wireless communications. Future challenges and potential trends of 5G-and-beyond applications and related materials technologies are also addressed. Throughout this book, illustrations clarify core concepts, techniques, and processes. At the end of each chapter, references serve as a gateway to the primary literature in the field. This book is essential reading for today’s students, scientists, engineers and professionals who want to understand the current status and future trends in materials advancement and component design in 5G and beyond, and acquire skills for selecting and using materials and 5G component design that takes economic and regulatory aspects into account.Springer Series in Materials Science,2196-2812 ;327Optical communicationsSemiconductorsTelecommunicationOptical CommunicationsSemiconductorsCommunications Engineering, NetworksMicrowaves, RF Engineering and Optical CommunicationsOptical communications.Semiconductors.Telecommunication.Optical Communications.Semiconductors.Communications Engineering, Networks.Microwaves, RF Engineering and Optical Communications.405621.38456Tong Xingcun Colin1063324MiAaPQMiAaPQMiAaPQ9910631092503321Advanced materials and components for 5G and beyond3083054UNINA