02484oas 22007573a 450 991062517130332120251106213014.0(OCoLC)430058414(CONSER) 2009204101(CKB)1000000000771037(EXLCZ)99100000000077103720090811a20079999 sy aengur|||||||||||txtrdacontentcrdamediacrrdacarrierProceedings of technical papersPiscataway, NJ Institute of Electrical and Electronics EngineersPublished by Institute of Electrical and Electronics Engineers in association with individual conference organizations.2150-5942 Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), InternationalInternational Microsystems, Packaging, Assembly, and Circuits Technology ConferenceIMPACTProc. tech. pap.Microelectronic packagingCongressesElectronic packagingCongressesMicroelectronicsCongressesMise sous boîtier (Microélectronique)CongrèsMise sous boîtier (Électronique)CongrèsMicroélectroniqueCongrèsElectronic packagingfast(OCoLC)fst00907414Microelectronic packagingfast(OCoLC)fst01019751Microelectronicsfast(OCoLC)fst01019757Conference papers and proceedings.fastMicroelectronic packagingElectronic packagingMicroelectronicsMise sous boîtier (Microélectronique)Mise sous boîtier (Électronique)MicroélectroniqueElectronic packaging.Microelectronic packaging.Microelectronics.621.381Institute of Electrical and Electronics EngineersDLCDLCSTFOCLCQOCLCFOCLCOOCLOCLCOOCLCQOCLCAU3WOCLCLTXAAU@OCLCLOCLCQJOURNAL9910625171303321Proceedings of technical papers1888335UNINA