03883nam 2200817z- 450 991055740150332120231214133639.0(CKB)5400000000043662(oapen)https://directory.doabooks.org/handle/20.500.12854/68490(EXLCZ)99540000000004366220202105d2021 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierLatest Advances in Electrothermal ModelsBasel, SwitzerlandMDPI - Multidisciplinary Digital Publishing Institute20211 electronic resource (140 p.)3-0365-0334-X 3-0365-0335-8 This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode–transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.History of engineering & technologybicsscDual-Phase-Lag heat transfer modelthermal simulation algorithmthermal measurementsFinite Difference Method schemeGrünwald–Letnikov fractional derivativeKrylov subspace-based model order reductionalgorithm efficiency analysisrelative error analysisalgorithm convergence analysiscomputational complexity analysisfinite difference method schemeBJTmodellingself-heatingsilicon carbideSPICEIGBTDC–DC converterelectrothermal modelaveraged modelthermal phenomenadiode–transistor switchpower electronicsmulti-LED lighting modulesdevice thermal couplingcompact thermal modelstemperature sensorsmicroprocessorthroughput improvementinductorsferromagnetic coresthermal modeltransient thermal impedancethermal resistanceelectrothermal (ET) simulationfinite-element method (FEM)model-order reduction (MOR)multicellular power MOSFETsilicon carbide (SiC)History of engineering & technologyGórecki Krzysztofedt1302753Górecki PawełedtGórecki KrzysztofothGórecki PawełothBOOK9910557401503321Latest Advances in Electrothermal Models3026515UNINA