05204nam 2201333z- 450 991055711850332120210501(CKB)5400000000040861(oapen)https://directory.doabooks.org/handle/20.500.12854/68284(oapen)doab68284(EXLCZ)99540000000004086120202105d2021 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierThermal and Electro-thermal System Simulation 2020Basel, SwitzerlandMDPI - Multidisciplinary Digital Publishing Institute20211 online resource (310 p.)3-03943-831-X 3-03943-832-8 This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the "thermal and electro-thermal system simulation" Special Issue of Energies. These contributions present the latest results in a currently very "hot" topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.History of engineering and technologybicssc3D ICaccuracy repeatability and reproducibility of thermal measurementsAlGaN-GaN HEMTBCI-DCTMbeyond CMOSBGACFDCoB LEDscompact thermal modelcomputation timeDelphi4LEDdetailed thermal modeldigital luminaire designdigital twinDVFSelectro-thermal modelelectro-thermal simulationelectronic packageselectronics coolingexperimental validationfinite volume methodheat generationheat transfer mechanismshotspotIndustry 4.0Joint Electron Device Engineering Council (JEDEC) metricsLEDLED lifetime modellingLED multi-domain modellinglife testinglifetime extrapolation and modelling of LEDsLight-emitting diodesliquid coolinglithium-ion batteryLM-80magnetic nanoparticlemeasurementsmicrochannelsmicrofluidicsmodal approachmodellingmodule temperaturemulti-domain modelingnon-destructive testingnonlinear thermal modelOpenFOAMoptical efficiencyphonon transport mechanismsphosphor modelingpower LED measurement and simulationpower LEDspulse transformerreliability testingrheologyROMself-heatingsize effectsolar energySPICESpice-like modelling of LEDsstatistical analysisTDTRthermal conductivitythermal impedancethermal interface resistancethermal modellingthermal padsthermal phenomenathermal resistancethermal simulationthermal testabilitythermal testing standardsthermal transient testingthermal-aware task schedulingthermal-electronic circuitsTM-21two-phase solververtical structureVO2History of engineering and technologyRencz Mártaedt1275267Codecasa LorenzoedtPoppe AndrasedtRencz MártaothCodecasa LorenzoothPoppe AndrasothBOOK9910557118503321Thermal and Electro-thermal System Simulation 20203038145UNINA