05191nam 2201321z- 450 991055711850332120231214133501.0(CKB)5400000000040861(oapen)https://directory.doabooks.org/handle/20.500.12854/68284(EXLCZ)99540000000004086120202105d2021 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierThermal and Electro-thermal System Simulation 2020Basel, SwitzerlandMDPI - Multidisciplinary Digital Publishing Institute20211 electronic resource (310 p.)3-03943-831-X 3-03943-832-8 This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.History of engineering & technologybicssclithium-ion batterythermal modellingelectro-thermal modelheat generationexperimental validationthermal transient testingnon-destructive testingthermal testabilityaccuracy repeatability and reproducibility of thermal measurementsthermal testing standards3D ICmicrochannelsliquid coolingcompact thermal modelthermal simulationhotspotthermal-aware task schedulingDVFSstatistical analysiselectronic packagesdetailed thermal modelJoint Electron Device Engineering Council (JEDEC) metricsthermal impedanceAlGaN-GaN HEMTTDTRthermal conductivitythermal interface resistancesize effectphonon transport mechanismsnonlinear thermal modelSPICEpulse transformerthermal phenomenaself-heatingmodellingmeasurementsBCI-DCTMROMmodal approachBGAmodule temperaturesolar energyheat transfer mechanismspower LED measurement and simulationlife testingreliability testingLM-80TM-21LED lifetime modellingLED multi-domain modellingSpice-like modelling of LEDslifetime extrapolation and modelling of LEDsbeyond CMOSVO2thermal-electronic circuitselectro-thermal simulationvertical structurepower LEDsthermal padsthermal resistanceoptical efficiencyelectronics coolingLight-emitting diodesCoB LEDsmulti-domain modelingfinite volume methodphosphor modelingmagnetic nanoparticlemicrofluidicsCFDOpenFOAMtwo-phase solverrheologyLEDDelphi4LEDdigital twindigital luminaire designcomputation timeIndustry 4.0History of engineering & technologyRencz Mártaedt1275267Codecasa LorenzoedtPoppe AndrasedtRencz MártaothCodecasa LorenzoothPoppe AndrasothBOOK9910557118503321Thermal and Electro-thermal System Simulation 20203038145UNINA