02527nam 2200469 450 991048347770332120220927194305.0981-16-1376-110.1007/978-981-16-1376-0(CKB)4100000011930488(DE-He213)978-981-16-1376-0(MiAaPQ)EBC6627540(Au-PeEL)EBL6627540(OCoLC)1252421476(PPN)255888066(EXLCZ)99410000001193048820220122d2021 uy 0engurnn#008mamaatxtrdacontentcrdamediacrrdacarrierSemiconductor advanced packaging /John H. Lau1st ed. 2021.Gateway East, Singapore :Springer,[2021]©20211 online resource (XXII, 498 p. 557 illus., 530 illus. in color.)981-16-1375-3 Includes bibliographical references and index.Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging.The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.SemiconductorsDesign and constructionSemiconductorsDesign and construction.621.38152Lau John H.972648MiAaPQMiAaPQMiAaPQBOOK9910483477703321Semiconductor Advanced Packaging2212364UNINA