01734nam0-2200385 --450 991047175560332120210519110223.09789811201110(set)9789811201127(set 1 ; vol. 1)9789811201134(set 1 ; vol. 2)9789811201141(set 1 ; vol. 3)9789811201158(set 1 ; vol. 4)20210519d2020--------kmuy0itay5050----baengUSEncyclopedia of packaging materials, processes, and mechanicseditors-in-chief, Avram Bar-Cohen, Jeffrey C. Suhling,, Andrew A. O. TayHackensack, New Jersey :World Scientific Publishing Co. Pte. Ltd.,[2020]4 volumesill.25 cmIncludes bibliographical references and index.volume 1. Flip-chip and underfill materials and technology / editors, Pengli Zhu, Gang Li, C. P. Wongvolume 2. Wire bonding technology / editors, Dae Young Jung, Stephen R. Cain, William (Bill) T. Chen, Bahgat G. Sammakiavolume 3. Flexible chip I/O interconnects / editors, Muhannad S. Bakir, Suresh K. Sitaramanofvolume 4. Wafer bonding technology / Kuan-Neng Chen, Chuan Seng TanPackaging688.8Bar-Cohen,AvramSuhling,Jeffrey C.Tay,Andrew A. O.ITUNINARICAUNIMARCBK991047175560332113 SC V L 193617 / 2021FINBC13 SC V L 203618 / 2021FINBC13 SC V L 213619 / 2021FINBC13 SC V L 223620 / 2021FINBCFINBCEncyclopedia of packaging materials, processes, and mechanics1779985UNINA