02336nam 2200589 450 991046517500332120200520144314.01-5231-1742-71-60807-698-9(CKB)2560000000254538(EBL)1579692(OCoLC)905527317(SSID)ssj0001437312(PQKBManifestationID)12620082(PQKBTitleCode)TC0001437312(PQKBWorkID)11445102(PQKB)10020856(MiAaPQ)EBC1579692(Au-PeEL)EBL1579692(CaPaEBR)ebr11069371(CaBNVSL)mat09100896(IEEE)9100896(EXLCZ)99256000000025453820200730d2013 uy engurcnu||||||||txtccrMicrowave and millimeter-wave electronic packaging /Rick SturdivantBoston [Massachusetts] ;London [England] :Artech House,2014.[Piscataqay, New Jersey] :IEEE Xplore,[2013]1 online resource (281 p.)Artech House Microwave LibraryDescription based upon print version of record.1-60807-697-0 Includes bibliographical references at the end of each chapters and index.Introduction -- Materials -- Ceramic packaging -- Laminate packaging -- First-level interconnects -- Second-level interconnects -- Modules and motherboards -- Transitions and 3D packaging -- Heat transfer -- Electromagnetic modeling -- Conclusions and future horizons.Presenting the packaging issues which are unique to microwave and millimeter-wave frequencies, this book reviews lower frequency packaging techniques and how they can be tailored or analyzed for higher frequency designs. --Edited summary from book.Artech House microwave library.Microelectronic packagingElectronic books.Microelectronic packaging.621.381046Sturdivant Rick983521CaBNVSLCaBNVSLCaBNVSLBOOK9910465175003321Microwave and millimeter-wave electronic packaging2295112UNINA