01987oam 2200541I 450 991046277340332120200520144314.01-283-91947-80-203-09506-51-136-21113-610.4324/9780203095065 (MiAaPQ)EBC1104763(Au-PeEL)EBL1104763(CaPaEBR)ebr10641698(CaONFJC)MIL423197(OCoLC)823389972(OCoLC)823041415(EXLCZ)99267000000031526520180706d2013 uy 0engurun#|||uuuuuSocial work, law and ethics /Jonathan DickensLondon ;New York, NY :Routledge,2013.x, 197pStudent social workStudent social workDescription based upon print version of record.0-415-59016-7 0-415-59015-9 Includes bibliographical references and index.Key concepts -- Fairness -- The legal framework -- The ethical framework -- Freedom and society -- End of life decisions -- Choices, capacity and competence -- Responsibility and circumstances -- Responsibility and blame -- Crime, punishment and protection -- Culture and difference -- Confidentiality, information-sharing and openness -- Organisations and individuals.Student Social WorkSocial serviceSocial workersLegal status, laws, etcSocial workersProfessional ethicsElectronic books.Social service.Social workersLegal status, laws, etc.Social workersProfessional ethics.174/.9361Dickens Jonathan1961-,859860MiAaPQMiAaPQMiAaPQBOOK9910462773403321Social work, law and ethics1918677UNINA01667nam 2200397 450 991014542710332120230721004822.01-5090-8060-01-4244-3624-9(CKB)1000000000710048(WaSeSS)IndRDA00093384(WaSeSS)IndRDA00119576(EXLCZ)99100000000071004820200304d2008 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP) 10th International Conference on Electronic Materials & Packaging (EMAP) : 22-24 October 2008, Taipei /compiled by Institute of Electrical and Electronics EngineersPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,2008.1 online resource (423 pages)1-4244-3622-2 1-4244-3623-0 Microelectronic packagingCongressesMicroelectromechanical systemsCongressesMicroelectronic packagingMicroelectromechanical systems621.381046Institute of Electrical and Electronics Engineers,WaSeSSWaSeSSPROCEEDING99101454271033212008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference : 10th International Conference on Electronic Materials & Packaging (EMAP)2546557UNINA01704nam0 2200409 i 450 VAN0012399520240806100815.170N978331960513520191007d2017 |0itac50 baengCH|||| |||||HemomathThe Mathematics of BloodAntonio Fasano, Adélia SequeiraChamSpringer2017xvii, 340 p.ill.24 cm001VAN001032282001 MS&Amodeling, simulation & applications210 Berlin [etc.]Springer18VAN00235652Hemomath156244676ZxxBiological fluid mechanics [MSC 2020]VANC035187MF92-XXBiology and other natural sciences [MSC 2020]VANC020839MF92C35Physiological flow [MSC 2020]VANC035188MFBiomathematicsKW:KDialysisKW:KHematologyKW:KHemorheologyKW:KNephrologyKW:KCHChamVANL001889FasanoAntonioVANV03908940516SequeiraAdéliaVANV079225344921Springer <editore>VANV108073650ITSOL20241115RICAhttp://doi.org/10.1007/978-3-319-60513-5E-book – Accesso al full-text attraverso riconoscimento IP di Ateneo, proxy e/o ShibbolethBIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICAIT-CE0120VAN08NVAN00123995BIBLIOTECA DEL DIPARTIMENTO DI MATEMATICA E FISICA08DLOAD e-book 0712 08eMF712 20191007 Hemomath1562446UNICAMPANIA