04125nam 22007812 450 991046243530332120151005020622.01-107-22699-61-139-41127-61-280-77372-397866136844931-139-42263-40-511-77724-81-139-41961-71-139-41756-81-139-42166-21-139-42370-3(CKB)2670000000205911(EBL)907131(OCoLC)795895596(SSID)ssj0000678157(PQKBManifestationID)11449750(PQKBTitleCode)TC0000678157(PQKBWorkID)10699135(PQKB)11349310(UkCbUP)CR9780511777240(MiAaPQ)EBC907131(Au-PeEL)EBL907131(CaPaEBR)ebr10578260(CaONFJC)MIL368449(EXLCZ)99267000000020591120100514d2012|||| uy| 0engur|||||||||||txtrdacontentcrdamediacrrdacarrierLCP for microwave packages and modules /[edited by] Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara[electronic resource]Cambridge :Cambridge University Press,2012.1 online resource (xiv, 253 pages) digital, PDF file(s)The Cambridge RF and microwave engineering seriesTitle from publisher's bibliographic system (viewed on 05 Oct 2015).1-107-00378-4 Includes bibliographical references and index.Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability.A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.Cambridge RF and microwave engineering series.LCP for Microwave Packages & ModulesMicrowave devicesMaterialsFlexible electronicsMicroelectronic packagingMaterialsLiquid crystal devicesPolymer liquid crystalsMicrowave devicesMaterials.Flexible electronics.Microelectronic packagingMaterials.Liquid crystal devices.Polymer liquid crystals.621.381/3Pham Anh-Vu H.Chen Morgan J.Aihara KuniaUkCbUPUkCbUPBOOK9910462435303321LCP for microwave packages and modules2458683UNINA