02786nam 2200613 a 450 991045621600332120200520144314.01-283-14371-29786613143716981-4273-33-3(CKB)2490000000001958(EBL)731200(OCoLC)714877548(SSID)ssj0000522259(PQKBManifestationID)12179974(PQKBTitleCode)TC0000522259(PQKBWorkID)10539782(PQKB)10396681(MiAaPQ)EBC731200(WSP)00007294(Au-PeEL)EBL731200(CaPaEBR)ebr10480052(CaONFJC)MIL314371(EXLCZ)99249000000000195820110308d2010 uy 0engur|n|---|||||txtccrElectromigration in ULSI interconnections[electronic resource] /Cher Ming TanHackensack, N.J. World Scientificc20101 online resource (312 p.)International series on advances in solid state electronics and technology (ASSET)Description based upon print version of record.981-4273-32-5 Includes bibliographical references and index.Preface; Contents; 1. Introduction; 2. History of Electromigration; 3. Experimental Studies of Al Interconnections; 4. Experimental Studies of Cu Interconnections; 5. Numerical Modeling of Electromigration; 6. Future Challenges; Index; Biography""Electromigration in ULSI Interconnections"" provides a comprehensive description of the electro migration in integrated circuits. It is intended for both beginner and advanced readers on electro migration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electro migration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electro migration in both Al- and Cu-based Interconnections, in the form of theoretical, experimInternational series on advances in solid state electronics and technology.Integrated circuitsUltra large scale integrationElectrodiffusionElectronic books.Integrated circuitsUltra large scale integration.Electrodiffusion.621.395Tan Cher Ming1959-924832MiAaPQMiAaPQMiAaPQBOOK9910456216003321Electromigration in ULSI interconnections2075797UNINA