02746nam 2200601Ia 450 991044984460332120200520144314.01-280-47971-X97866104797191-84544-723-9(CKB)1000000000001641(EBL)233751(OCoLC)61370324(SSID)ssj0000465761(PQKBManifestationID)11973155(PQKBTitleCode)TC0000465761(PQKBWorkID)10457759(PQKB)11497489(MiAaPQ)EBC233751(Au-PeEL)EBL233751(CaPaEBR)ebr10052700(CaONFJC)MIL47971(OCoLC)133164115(EXLCZ)99100000000000164120000815d2002 uy 0engur|n|---|||||txtccrComputational modelling[electronic resource] /guest editor, Chris BaileyBradford, England Emerald Group Publishingc20021 online resource (69 p.)Soldering & surface mount technology ;v.14, no. 1Description based upon print version of record.0-86176-677-6 Contents; Abstracts & keywords; Editorial; Correlation of solder paste rheology with computational simulations of the stencil printing process; Solder paste reflow modeling; Numerical modelling of scanned beam laser soldering of fine pitch packages; A simplified model of the reflow soldering process; CFD modelling of the flow field inside a reflow oven; Analysis on solder ball shear testing conditions with a simple computational model; Optimisation modelling for flip-chip solder joint reliability; Internet commentary; Book review; Industry news; Appointments; International diaryNote from the publisherThis special issue of SSMT brings together seven papersdemonstrating the latest achievements in the applications ofcomputational modelling technology to soldering processesand solder joint reliability.Why use computational models?The performance of soldering materials during productassembly is governed by complex interacting physicalphenomena.Solder and solderingMathematical modelsSurface mount technologyMathematical modelsElectronic books.Solder and solderingMathematical models.Surface mount technologyMathematical models.621.381531Bailey Chris930333MiAaPQMiAaPQMiAaPQBOOK9910449844603321Computational modelling2092694UNINA