04056nam 22007695 450 991043781750332120200630194721.03-642-37614-210.1007/978-3-642-37614-6(CKB)2670000000406827(EBL)1398765(SSID)ssj0000960640(PQKBManifestationID)11572937(PQKBTitleCode)TC0000960640(PQKBWorkID)10960363(PQKB)10385717(DE-He213)978-3-642-37614-6(MiAaPQ)EBC1398765(PPN)172426413(EXLCZ)99267000000040682720130716d2013 u| 0engur|n|---|||||txtccrDesign of Adhesive Joints Under Humid Conditions /edited by Lucas F. M. da Silva, Chiaki Sato1st ed. 2013.Berlin, Heidelberg :Springer Berlin Heidelberg :Imprint: Springer,2013.1 online resource (185 p.)Advanced Structured Materials,1869-8433 ;25Description based upon print version of record.3-642-44665-5 3-642-37613-4 Includes bibliographical references.Diffusion of moisture in adhesives -- Diffusion of moisture in interfaces -- Surface treatments for moisture resistance -- Influence of moisture on the adhesive properties -- Influence of water on the interface properties -- Prediction of joint strength under humid conditions: Continuum mechanics approach -- Prediction of joint strength under humid conditions: Fracture mechanics approach -- Prediction of joint strength under humid conditions: Damage mechanics approach.This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It  presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increase in numerical computing power there have been attempts to formalize the different environmental contributions in order to provide a procedure to predict assembly durability, based on an initial identification of diffusion coefficients and mechanical parameters for both the adhesive and the interface. A coupled numerical model for the joint of interest is then constructed and this allows local water content to be defined and resulting changes in adhesive and interface properties to be predicted.Advanced Structured Materials,1869-8433 ;25Materials—SurfacesThin filmsMechanicsMechanics, AppliedPolymers  Aerospace engineeringAstronauticsSurfaces and Interfaces, Thin Filmshttps://scigraph.springernature.com/ontologies/product-market-codes/Z19000Solid Mechanicshttps://scigraph.springernature.com/ontologies/product-market-codes/T15010Polymer Scienceshttps://scigraph.springernature.com/ontologies/product-market-codes/C22008Aerospace Technology and Astronauticshttps://scigraph.springernature.com/ontologies/product-market-codes/T17050Materials—Surfaces.Thin films.Mechanics.Mechanics, Applied.Polymers  .Aerospace engineering.Astronautics.Surfaces and Interfaces, Thin Films.Solid Mechanics.Polymer Sciences.Aerospace Technology and Astronautics.660.293da Silva Lucas F. Medthttp://id.loc.gov/vocabulary/relators/edtSato Chiakiedthttp://id.loc.gov/vocabulary/relators/edtBOOK9910437817503321Design of Adhesive Joints Under Humid Conditions2496952UNINA