01393nam 2200373 450 991038946080332120230824224534.01-7281-4870-7(CKB)5280000000207669(NjHacI)995280000000207669(EXLCZ)99528000000020766920230418d2019 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2019 International 3D Systems Integration Conference (3DIC 2019) October 8-10, 2019, Sendai, Japan /Institute of Electrical and Electronics Engineers[Piscataway, New Jersey] :Institute of Electrical and Electronics Engineers,2019.1 online resource (various pagings) illustrations1-7281-4871-5 Integrated circuitsDesign and constructionCongressesThree-dimensional imagingCongressesThree-dimensional integrated circuitsCongressesIntegrated circuitsDesign and constructionThree-dimensional imagingThree-dimensional integrated circuits515.43NjHacINjHaclPROCEEDING99103894608033212019 International 3D Systems Integration Conference (3DIC 2019)3433028UNINA