03575nam 22006975 450 991035030170332120200629231200.0981-13-3627-X10.1007/978-981-13-3627-0(CKB)4100000008525770(DE-He213)978-981-13-3627-0(MiAaPQ)EBC5759460(PPN)235666920(EXLCZ)99410000000852577020190423d2019 u| 0engurnn|008mamaatxtrdacontentcrdamediacrrdacarrierModeling and Application of Flexible Electronics Packaging /by YongAn Huang, Zhouping Yin, Xiaodong Wan1st ed. 2019.Singapore :Springer Singapore :Imprint: Springer,2019.1 online resource (XVII, 287 p.) 981-13-3626-1 Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.ElectronicsMicroelectronicsOptical materialsElectronic materialsManufacturesMechanicsMechanics, AppliedComputer simulationElectronics and Microelectronics, Instrumentationhttps://scigraph.springernature.com/ontologies/product-market-codes/T24027Optical and Electronic Materialshttps://scigraph.springernature.com/ontologies/product-market-codes/Z12000Manufacturing, Machines, Tools, Processeshttps://scigraph.springernature.com/ontologies/product-market-codes/T22050Theoretical and Applied Mechanicshttps://scigraph.springernature.com/ontologies/product-market-codes/T15001Simulation and Modelinghttps://scigraph.springernature.com/ontologies/product-market-codes/I19000Electronics.Microelectronics.Optical materials.Electronic materials.Manufactures.Mechanics.Mechanics, Applied.Computer simulation.Electronics and Microelectronics, Instrumentation.Optical and Electronic Materials.Manufacturing, Machines, Tools, Processes.Theoretical and Applied Mechanics.Simulation and Modeling.621.381Huang YongAnauthttp://id.loc.gov/vocabulary/relators/aut941414Yin Zhoupingauthttp://id.loc.gov/vocabulary/relators/autWan Xiaodongauthttp://id.loc.gov/vocabulary/relators/autBOOK9910350301703321Modeling and Application of Flexible Electronics Packaging2123445UNINA