01135nam a2200313 i 450099100115155970753620020507111943.0970308s1968 us ||| | eng b10180813-39ule_instLE00642999ExLDip.to Fisicaita53.8.2537.612621.3.2.4QC611Blatt, F.S.463300Physics of electronic conduction in solids /F.S. BlattNew York :McGraw-Hill Book Co.,1968446 p. :ill. ;23 cm.Includes bibliographical references and index.Electric conductivitySolids.b1018081321-09-0627-06-02991001151559707536LE006 53.8.2 BLA12006000045087le006-E0.00-l- 00000.i1022178527-06-02LE006 53.8.2 BLA12006000177702le006-E0.00-l- 00000.i1022179727-06-02Physics of electronic conduction in solids190712UNISALENTOle00601-01-97ma -engus 0201867nam 2200445z- 450 9910347052203321202102111000040997(CKB)4920000000101994(oapen)https://directory.doabooks.org/handle/20.500.12854/48951(oapen)doab48951(EXLCZ)99492000000010199420202102d2013 |y 0gerurmn|---annantxtrdacontentcrdamediacrrdacarrierGrundlegende Aspekte des 2K-MetallpulverspritzgießensKIT Scientific Publishing20131 online resource (III, 138 p. p.)Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie3-7315-0217-8 An important requirement for the combination of two materials in order to get a low stress and low warpage, crack-free composite component is a timely synchronized sintering behavior of both components. The aim of this work was to analyze the effect of the particle size distribution on the sintering behavior and the resulting consequences of the particle size change for the flow properties during injection molding.Technology: general issuesbicsscfeedstockFeedstockmetal injection moldingFließverhaltenflow propertiesMetallpulverspritzgießenparticle size distributionPartikelgrößenverteilungensintering behaviorSinterverhaltenTechnology: general issuesHage Christophauth1294137BOOK9910347052203321Grundlegende Aspekte des 2K-Metallpulverspritzgießens3022918UNINA