01661nam 2200349z- 450 991034670300332120231214133618.01000034759(CKB)4920000000094664(oapen)https://directory.doabooks.org/handle/20.500.12854/49267(EXLCZ)99492000000009466420202102d2013 |y 0engurmn|---annantxtrdacontentcrdamediacrrdacarrierHigh Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput MethodKIT Scientific Publishing20131 electronic resource (XII, 140 p. p.)Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie3-7315-0025-6 In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.damage structureFatiguethin filmcantilever bendingBurger Sofieauth1302194BOOK9910346703003321High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method3026232UNINA