01374nam 2200385 450 991033034990332120230817180737.01-7281-3286-X(CKB)4100000008611639(WaSeSS)IndRDA00123309(EXLCZ)99410000000861163920200520d2019 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrier2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS 12-15 May 2019, Paris, France /Institute of Electrical and Electronics EngineersPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,2019.1 online resource (63 pages)1-7281-3257-6 Microelectronic packagingCongressesMicroelectromechanical systemsCongressesMicromachiningCongressesMicroelectronic packagingMicroelectromechanical systemsMicromachining621.381046Institute of Electrical and Electronics Engineers,WaSeSSWaSeSSPROCEEDING99103303499033212019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS2520494UNINA