01376nam 2200373 450 991032665880332120230817180518.04-904743-07-5(CKB)4100000008419327(WaSeSS)IndRDA00123063(EXLCZ)99410000000841932720200518d2019 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrierLTB-3D 2019 6th International Workshop on Low Temperature Bonding for 3D Integration : proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, May 21 -25, 2019, Kanazawa, Ishikawa, Japan /Institute of Electrical and Electronics EngineersPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,2019.1 online resource (90 pages)1-7281-0387-8 Three-dimensional integrated circuits CongressesSealing (Technology)CongressesPhotonicsMaterialsCongressesThree-dimensional integrated circuits Sealing (Technology)PhotonicsMaterials621.885WaSeSSWaSeSSPROCEEDING9910326658803321LTB-3D2497176UNINA