01397nam 2200361 450 991032565590332120230817193542.01-7281-1749-6(CKB)4100000008337702(WaSeSS)IndRDA00123222(EXLCZ)99410000000833770220200519d2019 uy 0engur|||||||||||txtrdacontentcrdamediacrrdacarrierProceedings for 2019 IEEE COOL Chips 22 IEEE Symposium on Low-Power and High-Speed Chips and Systems : proceedings : Yokohama Joho Bunka Center, Yokohama, Japan (Yokohama Media & Communications Center, Yokohama, Japan), April 17-19, 2019 /Institute of Electrical and Electronics EngineersPiscataway, New Jersey :Institute of Electrical and Electronics Engineers,2019.1 online resource (349 pages)1-7281-1750-X Integrated circuitsCongressesVery high speed integrated circuitsCongressesIntegrated circuitsVery high speed integrated circuits621.3815Institute of Electrical and Electronics Engineers,WaSeSSWaSeSSPROCEEDING9910325655903321Proceedings for 2019 IEEE COOL Chips 222526250UNINA