00996nam0-22003251i-450-99000289173040332188-458-0127-6000289173FED01000289173(Aleph)000289173FED0100028917320000920d1998----km-y0itay50------baITA<<Le >>previsioni della spesa per pensioni, metodologie a confrontoatti del workshop, Roma 2 dicembre 1997Istituto Nazionale di StatisticaRomaIstat1998166 p.25 cmAnnali di statistica. Serie X16EconometriaItaliasistema pensionisticoEconomia331.25Istat445627ITUNINARICAUNIMARCBK990002891730403321CDI-AS-16-98-Pos-16182MASMASPrevisioni della spesa per pensioni, metodologie a confronto466928UNINAING0103531nam 22005535 450 991029988710332120251113211322.03-319-69673-410.1007/978-3-319-69673-7(CKB)4100000001041578(DE-He213)978-3-319-69673-7(MiAaPQ)EBC5149956(PPN)258873175(PPN)221255249(EXLCZ)99410000000104157820171116d2018 u| 0engurnn|008mamaatxtrdacontentcrdamediacrrdacarrierContactless VLSI Measurement and Testing Techniques /by Selahattin Sayil1st ed. 2018.Cham :Springer International Publishing :Imprint: Springer,2018.1 online resource (V, 93 p. 34 illus., 11 illus. in color.) 3-319-69672-6 Includes bibliographical references at the end of each chapters.1. Conventional Test Methods. – 2. Testability Design -- 3. Other Techniques Based on the Contacting Probe -- 4. Contactless Testing -- 5. Electron-Beam and Photoemission Probing -- 6. Electro Optic Sampling and Charge Density Probe -- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe -- 8. Probing Techniques Based on Light Emission from Chip -- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits -- 10. Comparison of Contactless Testing Methodologies.This book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing.  The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test: Provides a single-source reference on contactless probing approaches for VLSI testing and diagnostic measurement Introduces readers to various optical contactless testing techniques, such as Electro-Optic Probing, Charge Density Probe, and Photo-emissive Probe Discusses the applicability and adaptability of each technique, based on multilayer metallization, wafer level techniques, and invasiveness Provides a comparison among various contactless testing techniques Describes a variety of industrial applications of contactless VLSI testing.Electronic circuitsMicroprocessorsComputer architectureElectronicsElectronic Circuits and SystemsProcessor ArchitecturesElectronics and Microelectronics, InstrumentationElectronic circuits.Microprocessors.Computer architecture.Electronics.Electronic Circuits and Systems.Processor Architectures.Electronics and Microelectronics, Instrumentation.621.3815Sayil Selahattinauthttp://id.loc.gov/vocabulary/relators/aut763561BOOK9910299887103321Contactless VLSI Measurement and Testing Techniques2527392UNINA