01063nam--2200361---450-99000325602020331620090527112320.0719002931000325602USA01000325602(ALEPH)000325602USA0100032560220090527d1967----km-y0itay50------baengGB||||||||001yyStudies in innovation in the steel and chemical industriesby J. A. AllenManchesterManchester university pressc1967X, 246 p., [1] c. di tav. ripieg.23 cm20012001001-------2001Industria chimica669.142ALLEN,James Albert604464ITsalbcISBD990003256020203316669.142 ALL24996 EC669.14200230698BKTECRSIAV49020090527USA011123Studies in innovation in the steel and chemical industries1120154UNISA01251nam2 2200301 i 450 RAV018547420231121125636.020220915d1977 ||||0itac50 baitaitz01i xxxe z01n2Roy A. MedvedevMilanoA. Mondadori1977P. 372-77019 cm.001RAV01854702001 ˜Lo œstalinismoRoy A. Medvedeva cura di David Joravsky e Georges Hauptprefazione di Georges Haupttraduzione di Raffaello Uboldi2Medvedev, Roj AleksandrovičCFIV070256070173681Medvedev, RojCFIV095963Medvedev, Roj AleksandrovičMedvedev, Roy AleksandrovichCFIV199917Medvedev, Roj AleksandrovičMedvedev, RoyIEIV060115Medvedev, Roj AleksandrovičITIT-0120220915IT-FR0098 Biblioteca Area Giuridico EconomicaFR0098 NRAV0185474Biblioteca Area Giuridico Economica 53ATENE E1 MED 53ATE0000284005 VMS A4 Dono Fam. CarandiniA 2022091520220915 5323615791UNICAS04477nam 22006975 450 991029985050332120200707024131.03-319-10295-810.1007/978-3-319-10295-5(CKB)3710000000268426(EBL)1965227(OCoLC)908083111(SSID)ssj0001372467(PQKBManifestationID)11761796(PQKBTitleCode)TC0001372467(PQKBWorkID)11304280(PQKB)10557532(DE-He213)978-3-319-10295-5(MiAaPQ)EBC1965227(MiAaPQ)EBC4924801(Au-PeEL)EBL4924801(CaONFJC)MIL766642(OCoLC)894509026(PPN)182094219(EXLCZ)99371000000026842620141025d2015 u| 0engur|n|---|||||txtccrDry Etching Technology for Semiconductors /by Kazuo Nojiri1st ed. 2015.Cham :Springer International Publishing :Imprint: Springer,2015.1 online resource (126 p.)Description based upon print version of record.3-319-10294-X Includes bibliographical references.Contribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit -- Mechanism of Dry Etching -- Dry Etching of Various Materials -- Dry Etching Equipments -- Dry Etching Damage -- Latest Dry Etching Technologies -- Future Challenges and Outlook for Dry Etching Technology.This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits.  The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes.  The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc. Provides a comprehensive, systematic guide to dry etching technologies, from basics to latest technologies; Enables beginners to understand the mechanisms of dry etching, without complexities of numerical formulas/equations; Describes etching processes for all materials which are used in semiconductor devices, explains key etching parameters for each material, and explains why a particular plasma source and etching gas chemistry is used for each material; Discusses the device manufacturing flow and explains in which part of device manufacturing dry etching is actually used; Describes the types and plasma generation mechanism of etching equipment which are actually used in semiconductor fabs, such as CCP (Capacitively Coupled Plasma), Magnetron RIE (Magnetron Reactive Ion Etching), ECR (Electron Cyclotron Resonance) Plasma, and ICP (Inductively Coupled Plasma).Electronic circuitsSemiconductorsCircuits and Systemshttps://scigraph.springernature.com/ontologies/product-market-codes/T24068Electronic Circuits and Deviceshttps://scigraph.springernature.com/ontologies/product-market-codes/P31010Semiconductorshttps://scigraph.springernature.com/ontologies/product-market-codes/P25150Electronic circuits.Semiconductors.Circuits and Systems.Electronic Circuits and Devices.Semiconductors.537.622620621.3815Nojiri Kazuoauthttp://id.loc.gov/vocabulary/relators/aut720691MiAaPQMiAaPQMiAaPQBOOK9910299850503321Dry Etching Technology for Semiconductors1412451UNINA