03339nam 2200589 a 450 991029975190332120200520144314.01-4614-7190-710.1007/978-1-4614-7190-5(OCoLC)859588935(MiFhGG)GVRL6XSG(CKB)2670000000421461(MiAaPQ)EBC1398416(EXLCZ)99267000000042146120130709d2014 uy 0engurun|---uuuuatxtccrFlow boiling in microgap channels experiment, visualization and analysis /Tamanna Alam, Poh Seng Lee, Li-Wen Jin1st ed. 2014.New York Springer20141 online resource (xi, 84 pages) illustrations (some color)SpringerBriefs in applied sciences and technology : thermal engineering and applied science,2193-2530"ISSN: 2193-2530."1-4614-7189-3 Includes bibliographical references.Introduction -- Design and Operating Parameters -- Characteristics of Two-Phase Flow Boiling in Microgap Channel -- Comparison of Flow Boiling Characteristics between Microgap and Microchannel -- Optimization of Microgap Channel Dimension and Operating Condition -- Surface Roughness Effect on Microgap Channel -- Two-Phase Microgap Channel in Mitigating Flow Instabilities and Flow Reversal -- Two-Phase Microgap Channel Cooling Technology for Hotspots Mitigation -- Conclusions and Recommendations -- Appendix A: Uncertainty Analysis for Experimental Data -- Appendix B: Nomenclature -- Appendix C: Data Reduction.Flow Boiling in Microgap Channels: Experiment, Visualization and Analysis presents an up-to-date summary of the details of the confined to unconfined flow boiling transition criteria, flow boiling heat transfer and pressure drop characteristics, instability characteristics, two phase flow pattern and flow regime map and the parametric study of microgap dimension. Advantages of flow boiling in microgaps over microchannels are also highlighted. The objective of this Brief is to obtain a better fundamental understanding of the flow boiling processes, compare the performance between microgap and conventional microchannel heat sinks, and evaluate the microgap heat sink for instabilities and hotspot mitigation.SpringerBriefs in applied sciences and technology.Electronic apparatus and appliancesThermal propertiesElectronic apparatus and appliancesProtectionHeat sinks (Electronics)Electronic packagingSystem failures (Engineering)PreventionElectronic apparatus and appliancesThermal properties.Electronic apparatus and appliancesProtection.Heat sinks (Electronics)Electronic packaging.System failures (Engineering)Prevention.621.4021Alam Tamanna875360Lee Poh Seng1756157Jin Li-Wen1756158MiAaPQMiAaPQMiAaPQBOOK9910299751903321Flow boiling in microgap channels4193282UNINA