04649nam 22009015 450 991029966740332120200701080451.03-319-09647-810.1007/978-3-319-09647-6(CKB)3710000000262035(EBL)1968532(OCoLC)894245022(SSID)ssj0001372510(PQKBManifestationID)11767025(PQKBTitleCode)TC0001372510(PQKBWorkID)11304569(PQKB)10658319(DE-He213)978-3-319-09647-6(MiAaPQ)EBC1968532(PPN)182095460(EXLCZ)99371000000026203520141015d2015 u| 0engur|n|---|||||txtccrThermal Transport in Oblique Finned Micro/Minichannels /by Yan Fan, Poh Seng Lee, Pawan Kumar Singh, Yong Jiun Lee1st ed. 2015.Cham :Springer International Publishing :Imprint: Springer,2015.1 online resource (143 p.)SpringerBriefs in Thermal Engineering and Applied Science,2193-2530Description based upon print version of record.3-319-09646-X Includes bibliographical references.Introduction -- Planar Oblique Fin Microchannel Heat Sink -- Cylindrical Oblique Fin Minichannel Heat Sink -- Thermal Management and Application for Oblique Fins -- Conclusions -- Appendix -- References.The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques  Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies. Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels.SpringerBriefs in Thermal Engineering and Applied Science,2193-2530ThermodynamicsHeat engineeringHeat transferMass transferFluid mechanicsElectronicsMicroelectronicsEnergy systemsMachineryEngineering Thermodynamics, Heat and Mass Transferhttps://scigraph.springernature.com/ontologies/product-market-codes/T14000Engineering Fluid Dynamicshttps://scigraph.springernature.com/ontologies/product-market-codes/T15044Electronics and Microelectronics, Instrumentationhttps://scigraph.springernature.com/ontologies/product-market-codes/T24027Energy Systemshttps://scigraph.springernature.com/ontologies/product-market-codes/115000Machinery and Machine Elementshttps://scigraph.springernature.com/ontologies/product-market-codes/T17039Thermodynamics.Heat engineering.Heat transfer.Mass transfer.Fluid mechanics.Electronics.Microelectronics.Energy systems.Machinery.Engineering Thermodynamics, Heat and Mass Transfer.Engineering Fluid Dynamics.Electronics and Microelectronics, Instrumentation.Energy Systems.Machinery and Machine Elements.660.2832Fan Yanauthttp://id.loc.gov/vocabulary/relators/aut1062398Lee Poh Sengauthttp://id.loc.gov/vocabulary/relators/autSingh Pawan Kumarauthttp://id.loc.gov/vocabulary/relators/autLee Yong Jiunauthttp://id.loc.gov/vocabulary/relators/autMiAaPQMiAaPQMiAaPQBOOK9910299667403321Thermal Transport in Oblique Finned Micro2525400UNINA