03990nam 22005175 450 991025416880332120200705084959.03-319-29746-510.1007/978-3-319-29746-0(CKB)3710000000746175(DE-He213)978-3-319-29746-0(MiAaPQ)EBC4587051(PPN)194516539(EXLCZ)99371000000074617520160709d2017 u| 0engurnn|008mamaatxtrdacontentcrdamediacrrdacarrierCarbon Nanotubes for Interconnects Process, Design and Applications /edited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci1st ed. 2017.Cham :Springer International Publishing :Imprint: Springer,2017.1 online resource (XII, 333 p. 167 illus., 133 illus. in color.) 3-319-29744-9 Includes bibliographical references at the end of each chapters.Interconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes – Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs.This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.Electronic circuitsMicroprocessorsCircuits and Systemshttps://scigraph.springernature.com/ontologies/product-market-codes/T24068Processor Architectureshttps://scigraph.springernature.com/ontologies/product-market-codes/I13014Electronic Circuits and Deviceshttps://scigraph.springernature.com/ontologies/product-market-codes/P31010Electronic circuits.Microprocessors.Circuits and Systems.Processor Architectures.Electronic Circuits and Devices.621.3815Todri-Sanial Aidaedthttp://id.loc.gov/vocabulary/relators/edtDijon Jeanedthttp://id.loc.gov/vocabulary/relators/edtMaffucci Antonioedthttp://id.loc.gov/vocabulary/relators/edtBOOK9910254168803321Carbon Nanotubes for Interconnects2262074UNINA