04234nam 22006495 450 991025405370332120200629194311.03-319-43220-610.1007/978-3-319-43220-5(CKB)3710000000862093(DE-He213)978-3-319-43220-5(MiAaPQ)EBC4691285(PPN)195512278(EXLCZ)99371000000086209320160916d2016 u| 0engurnn#008mamaatxtrdacontentcrdamediacrrdacarrierDielectric Breakdown in Gigascale Electronics Time Dependent Failure Mechanisms /by Juan Pablo Borja, Toh-Ming Lu, Joel Plawsky1st ed. 2016.Cham :Springer International Publishing :Imprint: Springer,2016.1 online resource (VIII, 105 p. 74 illus., 33 illus. in color.)SpringerBriefs in Materials,2192-10913-319-43218-4 Includes bibliographical references at the end of each chapters.Introduction -- General Theories -- Measurement Tools and Test Structures -- Experimental Techniques -- Breakdown Experiments -- Kinetics of Charge Carrier Confinement in Thin Dielectrics -- Theory of Dielectric Breakdown in Nanoporous Thin Films -- Dielectric Breakdown in Copper Interconnects -- Reconsidering Conventional Models.This book focuses on the experimental and theoretical aspects of the time-dependent breakdown of advanced dielectric films used in gigascale electronics. Coverage includes the most important failure mechanisms for thin low-k films, new and established experimental techniques, recent advances in the area of dielectric failure, and advanced simulations/models to resolve and predict dielectric breakdown, all of which are of considerable importance for engineers and scientists working on developing and integrating present and future chip architectures. The book is specifically designed to aid scientists in assessing the reliability and robustness of electronic systems employing low-k dielectric materials such as nano-porous films. Similarly, the models presented here will help to improve current methodologies for estimating the failure of gigascale electronics at device operating conditions from accelerated lab test conditions. Numerous graphs, tables, and illustrations are included to facilitate understanding of the topics. Readers will be able to understand dielectric breakdown in thin films along with the main failure modes and characterization techniques. In addition, they will gain expertise on conventional as well as new field acceleration test models for predicting long term dielectric degradation.SpringerBriefs in Materials,2192-1091Optical materialsElectronicsMaterialsNanotechnologyElectronic circuitsOptical and Electronic Materialshttps://scigraph.springernature.com/ontologies/product-market-codes/Z12000Nanotechnology and Microengineeringhttps://scigraph.springernature.com/ontologies/product-market-codes/T18000Electronic Circuits and Deviceshttps://scigraph.springernature.com/ontologies/product-market-codes/P31010Nanotechnologyhttps://scigraph.springernature.com/ontologies/product-market-codes/Z14000Optical materials.ElectronicsMaterials.Nanotechnology.Electronic circuits.Optical and Electronic Materials.Nanotechnology and Microengineering.Electronic Circuits and Devices.Nanotechnology.621.3817Borja Juan Pabloauthttp://id.loc.gov/vocabulary/relators/aut1059898Lu Toh-Mingauthttp://id.loc.gov/vocabulary/relators/autPlawsky Joelauthttp://id.loc.gov/vocabulary/relators/autMiAaPQMiAaPQMiAaPQBOOK9910254053703321Dielectric Breakdown in Gigascale Electronics2509395UNINA